the principal constituent melting at a temperature of less than 400°C

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H01L2224/48701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48701the principal constituent melting at a temperature of less than 400°C

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having optimized wire bond positioning
- Patent number 6,812,580
- Issue date Nov 2, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS