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the principal constituent melting at a temperature of less than 400°C
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CPC
H01L2224/13201
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13201
the principal constituent melting at a temperature of less than 400°C
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last 30 patents
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Patent Grant
Diffusion soldering preform with varying surface profile
Patent number
11,764,185
Issue date
Sep 19, 2023
Infineon Technologies Austria AG
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated electronic device having flip-chip connection with circu...
Patent number
6,764,938
Issue date
Jul 20, 2004
Fujitsu Limited
Toshiya Akamatsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Integrated electronic device having flip-chip connection with circu...
Patent number
6,608,381
Issue date
Aug 19, 2003
Fujitsu Limited
Toshiya Akamatsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Integrated electronic device having flip-chip connection with circu...
Patent number
5,977,637
Issue date
Nov 2, 1999
Fujitsu Limited
Toshiya Akamatsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated electronic device having flip-chip connection with circu...
Patent number
5,611,481
Issue date
Mar 18, 1997
Fujitsu Limited
Toshiya Akamatsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
Publication number
20230065738
Publication date
Mar 2, 2023
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated electronic device having flip-chip connection with circu...
Publication number
20040209453
Publication date
Oct 21, 2004
FUJITSU LIMITED
Toshiya Akamatsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...
Publication number
20020050404
Publication date
May 2, 2002
TOSHIYA AKAMATSU
H01 - BASIC ELECTRIC ELEMENTS