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the principal constituent melting at a temperature of less than 400°C
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CPC
H01L2224/13301
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13301
the principal constituent melting at a temperature of less than 400°C
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last 30 patents
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Patent Grant
Methods for forming pillar bumps on semiconductor wafers
Patent number
9,831,201
Issue date
Nov 28, 2017
Guy F. Burgess
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic component-mounted structure, IC card and COF package
Patent number
9,516,749
Issue date
Dec 6, 2016
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yoshiyuki Wada
G02 - OPTICS