the principal constituent melting at a temperature of less than 400°C

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H01L2224/29301

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29301the principal constituent melting at a temperature of less than 400°C

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the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface material, an integrated circuit formed therewith,...

Thermal transfer structures for semiconductor die assemblies

Power module package and method of manufacturing the same

Alternative compositions for high temperature soldering applications

Thermal transfer structures for semiconductor die assemblies

Power module package

Anisotropic conductive film

Placing ultra-small or ultra-thin discrete components

Light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Semiconductor packaging containing sintering die-attach material

Light emitting device mount, light emitting apparatus including the...

Method of forming solder on pad on fine pitch PCB and method of fli...

Patents Applicationslast 30 patents

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

LIGHT EMITTING APPARATUS

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...

SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...