the principal metal being aluminium

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H01L23/53214

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53214the principal metal being aluminium

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device suppressing leakage current...
- Patent number 12,125,785
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND flash memory devices, and related electronic systems
- Patent number 12,096,626
- Issue date Sep 17, 2024
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Gallium nitride integrated circuits including non-gold-based metall...
- Patent number 12,087,713
- Issue date Sep 10, 2024
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method thereof
- Patent number 12,080,543
- Issue date Sep 3, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Yuanpeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspended semiconductor dies
- Patent number 12,074,095
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,027,518
- Issue date Jul 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase formation in three-dimensional memory device
- Patent number 11,997,851
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiang Hui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 11,990,416
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsinhsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing a semiconductor...
- Patent number 11,990,405
- Issue date May 21, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 11,984,445
- Issue date May 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing wire layer
- Patent number 11,978,667
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaixuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of connection structure of semiconductor device
- Patent number 11,916,018
- Issue date Feb 27, 2024
- United Microelectronics Corp.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,868
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 11,792,989
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycrystalline film, method for forming polycrystalline film, lase...
- Patent number 11,791,160
- Issue date Oct 17, 2023
- Kyushu University, National University Corporation
- Jun Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures having conductive portions in substrate in three...
- Patent number 11,792,980
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Ji Xia
- G11 - INFORMATION STORAGE
Information Patent Grant
Plurality of different size metal layers for a pad structure
- Patent number 11,784,124
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICES AND RELATED METHODS
- Publication number 20240422967
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND CELLS WITH ENHANCED ERASE SPEED THROUGH DIPOLE ENGINEERING...
- Publication number 20240365551
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Chang Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240321750
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Ryuji UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY
- Publication number 20240321660
- Publication date Sep 26, 2024
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240222368
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH METAL VIA STRUCTURES
- Publication number 20240153866
- Publication date May 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240030225
- Publication date Jan 25, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Yuanpeng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
- Publication number 20230395489
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230361019
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Fang-Wen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20230317518
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20230260901
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230238329
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURI...
- Publication number 20230215820
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuen-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PATTERNING FOR INTEGRATED CIRCUITS
- Publication number 20230170298
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20230155555
- Publication date May 18, 2023
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE INTEGRATED CIRCUITS
- Publication number 20230154875
- Publication date May 18, 2023
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230154853
- Publication date May 18, 2023
- CHANGXIN MEMORY TECHNOLOGIES , INC.
- Yulei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND FLASH MEMORY DEVICES, AND RELATED ELECTRONIC SYSTEMS
- Publication number 20230143455
- Publication date May 11, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-BASED GALLIUM NITRIDE INTEGRATED CIRCUITS
- Publication number 20230133481
- Publication date May 4, 2023
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED SEMICONDUCTOR DIES
- Publication number 20230089201
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon MALE
- H01 - BASIC ELECTRIC ELEMENTS

the principal metal being aluminium

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure with a contact to source/drain layers and f...

Semiconductor integrated circuit device suppressing leakage current...

Method for fabricating semiconductor device with redistribution plugs

3D NAND flash memory devices, and related electronic systems

Gallium nitride integrated circuits including non-gold-based metall...

Display panel and manufacturing method thereof

Suspended semiconductor dies

3D semiconductor devices and structures with metal layers

Three-dimensional stacking semiconductor assemblies with near zero...

Staircase formation in three-dimensional memory device

Semiconductor device and method for making the same

Semiconductor arrangement and method for producing a semiconductor...

3D semiconductor devices and structures with metal layers

Method for manufacturing wire layer

Selective tungsten deposition at low temperatures

Semiconductor device and method of fabricating the same

Via patterning for integrated circuits

Manufacturing method of connection structure of semiconductor device

Semiconductor device

Flat metal features for microelectronics applications

Semiconductor device having electrode pads arranged between groups...

Interconnect wires including relatively low resistivity cores

Contacts having a geometry to reduce resistance

Advanced metal interconnects with a replacement metal

Semiconductor device structure and method for manufacturing the same

Semiconductor structure including buffer layer

Word line structure of three-dimensional memory device

Polycrystalline film, method for forming polycrystalline film, lase...

Contact structures having conductive portions in substrate in three...

Plurality of different size metal layers for a pad structure

Patents Applicationslast 30 patents

MEMORY DEVICES AND RELATED METHODS

GATE CONTACT STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

3D NAND CELLS WITH ENHANCED ERASE SPEED THROUGH DIPOLE ENGINEERING...

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

INTERCONNECT WITH METAL VIA STRUCTURES

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS

SEMICONDUCTOR DEVICE

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

INTEGRATED CIRCUIT

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURI...

VIA PATTERNING FOR INTEGRATED CIRCUITS

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

GALLIUM NITRIDE INTEGRATED CIRCUITS

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE

3D NAND FLASH MEMORY DEVICES, AND RELATED ELECTRONIC SYSTEMS

ALUMINUM-BASED GALLIUM NITRIDE INTEGRATED CIRCUITS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SUSPENDED SEMICONDUCTOR DIES