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H01L23/53214
the principal metal being aluminium
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last 30 patents
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Patent Grant
Selective tungsten deposition at low temperatures
Patent number
11,967,525
Issue date
Apr 23, 2024
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,948,882
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Jihoon Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via patterning for integrated circuits
Patent number
11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of connection structure of semiconductor device
Patent number
11,916,018
Issue date
Feb 27, 2024
United Microelectronics Corp.
Chen-Yi Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,868
Issue date
Feb 20, 2024
Rohm Co., Ltd.
Katsuhisa Nagao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flat metal features for microelectronics applications
Patent number
11,908,739
Issue date
Feb 20, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contacts having a geometry to reduce resistance
Patent number
11,875,987
Issue date
Jan 16, 2024
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced metal interconnects with a replacement metal
Patent number
11,842,961
Issue date
Dec 12, 2023
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Word line structure of three-dimensional memory device
Patent number
11,792,989
Issue date
Oct 17, 2023
Yangtze Memory Technologies Co., Ltd.
Qiang Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polycrystalline film, method for forming polycrystalline film, lase...
Patent number
11,791,160
Issue date
Oct 17, 2023
Kyushu University, National University Corporation
Jun Gotoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structures having conductive portions in substrate in three...
Patent number
11,792,980
Issue date
Oct 17, 2023
Yangtze Memory Technologies Co., Ltd.
Ji Xia
G11 - INFORMATION STORAGE
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Patent Grant
Plurality of different size metal layers for a pad structure
Patent number
11,784,124
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
Patent number
11,769,738
Issue date
Sep 26, 2023
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and semiconductor chip including the same
Patent number
11,749,630
Issue date
Sep 5, 2023
Samsung Electronics Co., Ltd.
Byungwook Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
Patent number
11,735,524
Issue date
Aug 22, 2023
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of semiconductor integrated circuit fabrication
Patent number
11,735,477
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Feng Shieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming metal interconnection
Patent number
11,715,689
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming microelectronic devices, and related microelectr...
Patent number
11,705,367
Issue date
Jul 18, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory devices having a plurality of NAND strings...
Patent number
11,699,657
Issue date
Jul 11, 2023
Yangtze Memory Technologies Co., Ltd.
Jifeng Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor devices and structures with metal layers
Patent number
11,646,309
Issue date
May 9, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ion through-substrate via
Patent number
11,646,247
Issue date
May 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Yang Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally and electrically conductive interconnects
Patent number
11,637,068
Issue date
Apr 25, 2023
GLOBALFOUNDRIES U.S. Inc.
Anthony K. Stamper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for reducing thermal expansion mismatch duri...
Patent number
11,621,235
Issue date
Apr 4, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuen-Shian Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Storage device including semiconductor chips sealed with resin on m...
Patent number
11,616,024
Issue date
Mar 28, 2023
Kabushiki Kaisha Toshiba
Noritoshi Shibata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including a thick metal layer
Patent number
11,616,018
Issue date
Mar 28, 2023
Samsung Electronics Co., Ltd.
Juik Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
Publication number
20240030225
Publication date
Jan 25, 2024
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Yuanpeng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
Publication number
20240014133
Publication date
Jan 11, 2024
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
Publication number
20230395489
Publication date
Dec 7, 2023
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230361019
Publication date
Nov 9, 2023
NANYA TECHNOLOGY CORPORATION
Fang-Wen LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
Publication number
20230317518
Publication date
Oct 5, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT
Publication number
20230260901
Publication date
Aug 17, 2023
Samsung Electronics Co., Ltd.
Myoungsoo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
Publication number
20230238329
Publication date
Jul 27, 2023
Samsung Electronics Co., Ltd.
Keunwook SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURI...
Publication number
20230215820
Publication date
Jul 6, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Kuen-Shian CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA PATTERNING FOR INTEGRATED CIRCUITS
Publication number
20230170298
Publication date
Jun 1, 2023
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20230155555
Publication date
May 18, 2023
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM NITRIDE INTEGRATED CIRCUITS
Publication number
20230154875
Publication date
May 18, 2023
Analog Devices, Inc.
Daniel Piedra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20230154853
Publication date
May 18, 2023
CHANGXIN MEMORY TECHNOLOGIES , INC.
Yulei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D NAND FLASH MEMORY DEVICES, AND RELATED ELECTRONIC SYSTEMS
Publication number
20230143455
Publication date
May 11, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALUMINUM-BASED GALLIUM NITRIDE INTEGRATED CIRCUITS
Publication number
20230133481
Publication date
May 4, 2023
Analog Devices, Inc.
Daniel Piedra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20230130273
Publication date
Apr 27, 2023
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUSPENDED SEMICONDUCTOR DIES
Publication number
20230089201
Publication date
Mar 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Barry Jon MALE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADVANCED METAL INTERCONNECTS WITH A REPLACEMENT METAL
Publication number
20230066614
Publication date
Mar 2, 2023
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD OF INCREASING SUBTRACTIVE BITLINE AIR GAP HEIGHT
Publication number
20230065187
Publication date
Mar 2, 2023
John Hopkins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20230043650
Publication date
Feb 9, 2023
Samsung Electronics Co., Ltd.
Jihoon CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYCRYSTALLINE FILM, METHOD FOR FORMING POLYCRYSTALLINE FILM, LASE...
Publication number
20230027404
Publication date
Jan 26, 2023
V Technology Co., LTD.
Jun GOTOH
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD TH...
Publication number
20220384340
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
JUNGHOO SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES
Publication number
20220367264
Publication date
Nov 17, 2022
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Multi-Layer Shielding St...
Publication number
20220367381
Publication date
Nov 17, 2022
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20220344265
Publication date
Oct 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsinhsiang TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20220336305
Publication date
Oct 20, 2022
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20220328474
Publication date
Oct 13, 2022
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
Publication number
20220293569
Publication date
Sep 15, 2022
Micron Technology, Inc.
Owen R. FAY
H01 - BASIC ELECTRIC ELEMENTS