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H01L23/53228
the principal metal being copper
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Patents Grants
last 30 patents
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Patent Grant
Selective tungsten deposition at low temperatures
Patent number
11,967,525
Issue date
Apr 23, 2024
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
Patent number
11,961,816
Issue date
Apr 16, 2024
Rohm Co., Ltd.
Shoji Takei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for interlevel dielectric layer with regions o...
Patent number
11,955,421
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,948,882
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Jihoon Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical integrated circuit structure including edge coupling protec...
Patent number
11,940,659
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chen-Hao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pedestal-based pocket integration process for embedded memory
Patent number
11,942,133
Issue date
Mar 26, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming bonded semiconductor structure utilizing concave...
Patent number
11,935,854
Issue date
Mar 19, 2024
United Microelectronics Corp.
Chung-Sung Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,923,299
Issue date
Mar 5, 2024
Kioxia Corporation
Takao Sueyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier, assembly with a carrier, and method for producing a carrier
Patent number
11,923,303
Issue date
Mar 5, 2024
Osram Opto Semiconductors GmbH
Konrad Wagner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming self-aligned multi-metal interconnects
Patent number
11,923,311
Issue date
Mar 5, 2024
International Business Machines Corporation
Ashim Dutta
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for routing local interconnect structure at same level as re...
Patent number
11,916,077
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
Patent number
11,916,034
Issue date
Feb 27, 2024
Rohm Co., Ltd.
Shoji Takei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,868
Issue date
Feb 20, 2024
Rohm Co., Ltd.
Katsuhisa Nagao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flat metal features for microelectronics applications
Patent number
11,908,739
Issue date
Feb 20, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Diffusion layers in metal interconnects
Patent number
11,901,225
Issue date
Feb 13, 2024
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure and fabrication method thereof
Patent number
11,901,318
Issue date
Feb 13, 2024
United Microelectronics Corp.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating the same
Patent number
11,882,694
Issue date
Jan 23, 2024
SK Hynix Inc.
Sung Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced copper interconnects with hybrid microstructure
Patent number
11,881,433
Issue date
Jan 23, 2024
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon buried power rail implemented backside power distri...
Patent number
11,881,455
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Saehan Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contacts having a geometry to reduce resistance
Patent number
11,875,987
Issue date
Jan 16, 2024
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package panel processing with integrated ceramic isolation
Patent number
11,869,839
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package component
Patent number
11,869,857
Issue date
Jan 9, 2024
AMOSENSE CO., LTD
Ji-Hyung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ferroelectric memory devices
Patent number
11,871,583
Issue date
Jan 9, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated GaN power module
Patent number
11,862,688
Issue date
Jan 2, 2024
Apple Inc.
Ashish K. Sahoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ferroelectric memory device integrated with a transition electrode
Patent number
11,854,593
Issue date
Dec 26, 2023
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices, related electronic systems, and methods of...
Patent number
11,848,309
Issue date
Dec 19, 2023
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced metal interconnects with a replacement metal
Patent number
11,842,961
Issue date
Dec 12, 2023
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20240128214
Publication date
Apr 18, 2024
UNITED MICROELECTRONICS CORP.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20240128171
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Junwoo Myung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240114681
Publication date
Apr 4, 2024
SK HYNIX INC.
Sung Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS
Publication number
20240105564
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
Publication number
20240096785
Publication date
Mar 21, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
Publication number
20240096783
Publication date
Mar 21, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240096754
Publication date
Mar 21, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yuan FANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE T...
Publication number
20240088037
Publication date
Mar 14, 2024
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRU...
Publication number
20240088020
Publication date
Mar 14, 2024
NANYA TECHNOLOGY CORPORATION
TZU-CHING TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
Publication number
20240071929
Publication date
Feb 29, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240071923
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Minjun SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION
Publication number
20240071823
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
Publication number
20240057340
Publication date
Feb 15, 2024
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20240049449
Publication date
Feb 8, 2024
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
G11 - INFORMATION STORAGE
Information
Patent Application
MEMORY DEVICES AND ELECTRONIC SYSTEMS
Publication number
20240047428
Publication date
Feb 8, 2024
Micron Technology, Inc.
Fatma Arzum Simsek-Ege
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
Publication number
20240030225
Publication date
Jan 25, 2024
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Yuanpeng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
Publication number
20240014133
Publication date
Jan 11, 2024
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240014102
Publication date
Jan 11, 2024
Micron Technology, Inc.
Yutaka Nakae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240006306
Publication date
Jan 4, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Chengfeng LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY
Publication number
20240008280
Publication date
Jan 4, 2024
KIOXIA Corporation
Go OIKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-DIMENSIONAL PMOS DEVICES FOR PROVIDING CMOS IN BACK-END LAYERS...
Publication number
20230411390
Publication date
Dec 21, 2023
Intel Corporation
Kevin P. O'Brien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuits and Methods for I/O Circuitry TSV Coupling
Publication number
20230411351
Publication date
Dec 21, 2023
ARM Limited
Andy Wangkun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BIOLOGICAL SENSING SYSTEM HAVING MICRO-ELECTRODE ARRAY
Publication number
20230400450
Publication date
Dec 14, 2023
Purdue Research Foundation
Hossein Pajouhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
Publication number
20230395489
Publication date
Dec 7, 2023
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRU...
Publication number
20230386999
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
TZU-CHING TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...
Publication number
20230386972
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE
Publication number
20230387131
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS