the printed circuits being on the same board

Industry

CPC
H01R12/526

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HELECTRICITY H01Electric elements H01RLINE CONNECTORS CURRENT COLLECTORS H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits

Current Industry

H01R12/526the printed circuits being on the same board

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector and electronic device comprising same
- Patent number 11,533,814
- Issue date Dec 20, 2022
- Samsung Electronics Co., Ltd.
- Kyeongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly with a multilayer bus board
- Patent number 10,779,392
- Issue date Sep 15, 2020
- INTERPLEX INDUSTRIES, INC.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated through hole socketing coupled to a solder ball to engage wi...
- Patent number 10,741,947
- Issue date Aug 11, 2020
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer bus board
- Patent number 10,485,092
- Issue date Nov 19, 2019
- INTERPLEX INDUSTRIES, INC.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical power supply device for at least one LED and at least on...
- Patent number 10,427,585
- Issue date Oct 1, 2019
- Valeo Iluminacion
- Jose-David Roldan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrical interposer
- Patent number 10,230,183
- Issue date Mar 12, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sandeep Sankararaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control connector, electronic control for driving a herm...
- Patent number 10,199,757
- Issue date Feb 5, 2019
- Whirlpool S.A.
- Rafael Burg Rech
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Ground routing device and method
- Patent number 10,062,981
- Issue date Aug 28, 2018
- Intel Corporation
- Karlheinz Muth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket pin and semiconductor package test system
- Patent number 9,979,150
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Soongeol Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with laser soldering and method for assembling...
- Patent number 9,604,300
- Issue date Mar 28, 2017
- Lotes Co., Ltd.
- Ted Ju
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jumper module mounting circuit board and circuit board assembly
- Patent number 9,414,491
- Issue date Aug 9, 2016
- Yazaki Corporation
- Takanori Kitajo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic element having improved transformers and common mode chokes
- Patent number 9,101,071
- Issue date Aug 4, 2015
- Hon Hai Precision Industry Co., Ltd.
- Li-Chun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with staggered contact pads and compact component...
- Patent number 9,001,522
- Issue date Apr 7, 2015
- Apple Inc.
- Wyeman Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an interposer
- Patent number 8,322,031
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for connecting flat flex cable with an integrated...
- Patent number 7,891,988
- Issue date Feb 22, 2011
- Neoconix, Inc.
- Larry E. Dittmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for connecting a camera module, or like device, using flat f...
- Patent number 7,625,220
- Issue date Dec 1, 2009
- Larry E. Dittmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making electrical connector on a flexible carrier
- Patent number 7,587,817
- Issue date Sep 15, 2009
- Neoconix, Inc.
- John D. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cross-connecting by permutations using configurable printed circuits
- Patent number 7,473,851
- Issue date Jan 6, 2009
- Labinal
- Michel Dunand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slanted vias for electrical circuits on circuit boards and other su...
- Patent number 7,435,913
- Issue date Oct 14, 2008
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combinational jumper wire holder
- Patent number 7,390,230
- Issue date Jun 24, 2008
- Lite-On Technology Corp.
- Wen-Sheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension with no-solder, no-resin conductor extending through ins...
- Patent number 7,121,840
- Issue date Oct 17, 2006
- Magnecomp Corporation
- Warren Coon
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical connector on a flexible carrier
- Patent number 7,114,961
- Issue date Oct 3, 2006
- Neoconix, Inc.
- John D. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jumper chip component and mounting structure therefor
- Patent number 7,098,531
- Issue date Aug 29, 2006
- Alps Electric Co., Ltd.
- Shuji Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slanted vias for electrical circuits on circuit boards and other su...
- Patent number 7,083,425
- Issue date Aug 1, 2006
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bus coupling having an electromagnetic coupling int...
- Patent number 7,068,120
- Issue date Jun 27, 2006
- Intel Corporation
- Yinan Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical slip ring platter multilayer printed circuit board and m...
- Patent number 6,984,915
- Issue date Jan 10, 2006
- Electro-Tec Corp.
- Jack T. Galyean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive rivet for circuit card
- Patent number 6,951,467
- Issue date Oct 4, 2005
- The United States of America as represented by the Secretary of the Army
- David N. Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jumper chip component and mounting structure therefor
- Patent number 6,949,819
- Issue date Sep 27, 2005
- Alps Electric Co., Ltd.
- Shuji Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive wire
- Patent number 6,902,097
- Issue date Jun 7, 2005
- Koninklijke Philips Electronics N.V.
- Eddy W. Vanhoutte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board configuration with a multipole plug-in connector
- Patent number 6,812,411
- Issue date Nov 2, 2004
- Siemens Aktiengesellschaft
- Horst Belau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- Publication number 20240106139
- Publication date Mar 28, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210059060
- Publication date Feb 25, 2021
- LG ELECTRONICS INC.
- Daeseong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20210014985
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- Kyeongho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20200205279
- Publication date Jun 25, 2020
- Intel Corporation
- Jeremy Ecton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD
- Publication number 20200060022
- Publication date Feb 20, 2020
- Interplex Industries, Inc.
- Richard Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BUS BOARD
- Publication number 20180049310
- Publication date Feb 15, 2018
- Richard Schneider
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
GROUND ROUTING DEVICE AND METHOD
- Publication number 20160218453
- Publication date Jul 28, 2016
- Intel Corporation
- Karlheinz Muth
- G02 - OPTICS
Information Patent Application
Flat Connector and Bulkhead Mounting Structure
- Publication number 20140305695
- Publication date Oct 16, 2014
- Tyco Electronics Japan G.K.
- Shinichi Hashimoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Printed Circuits with Staggered Contact Pads and Compact Component...
- Publication number 20130122725
- Publication date May 16, 2013
- Apple Inc.
- Wyeman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ELEMENT HAVING IMPROVED TRANSFORMERS AND COMMOM MODE CHOKES
- Publication number 20110122589
- Publication date May 26, 2011
- HON HAI Precision Industry CO., LTD.
- LI-CHUN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100134126
- Publication date Jun 3, 2010
- M2N, INC.
- Ki-Pil Hong
- G01 - MEASURING TESTING
Information Patent Application
Method of making electrical connector on a flexible carrier
- Publication number 20100075514
- Publication date Mar 25, 2010
- Neoconix, Inc.
- John David Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for connecting flat flx cable with an integrated...
- Publication number 20100055941
- Publication date Mar 4, 2010
- Neoconix, Inc.
- Larry E. Dittmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLANTED VIAS FOR ELECTRICAL CIRCUITS ON CIRCUIT BOARDS AND OTHER SU...
- Publication number 20090008144
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, METHOD FOR INSPECTING ELECTRIC CIRCUIT, AND METH...
- Publication number 20080048695
- Publication date Feb 28, 2008
- Nobuyuki ASHIDA
- G01 - MEASURING TESTING
Information Patent Application
Interconnection device for a double-sided printed circuit board
- Publication number 20070184688
- Publication date Aug 9, 2007
- Cesar Avitia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package connected to a substrate
- Publication number 20070002549
- Publication date Jan 4, 2007
- Patricia A. Brusso
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System for connecting a camera module, or like device, using flat f...
- Publication number 20060276059
- Publication date Dec 7, 2006
- Neoconix Inc.
- Larry E. Dittmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector on a flexible carrier
- Publication number 20060258183
- Publication date Nov 16, 2006
- NEOCONIX, INC.
- John D. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Slanted vias for electrical circuits on circuit boards and other su...
- Publication number 20060240687
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector on a flexible carrier
- Publication number 20060113107
- Publication date Jun 1, 2006
- John D. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Slanted vias for electrical circuits on circuit boards and other su...
- Publication number 20060046537
- Publication date Mar 2, 2006
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cross-connecting by permutations using configurable printed circuits
- Publication number 20050241852
- Publication date Nov 3, 2005
- LABINAL
- Michel Dunand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically conductive wire
- Publication number 20050224932
- Publication date Oct 13, 2005
- Eddy W. Vanhoutte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jumper chip component and mounting structure therefor
- Publication number 20040256716
- Publication date Dec 23, 2004
- Alps Electric Co., Ltd.
- Shuji Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically conductive wire
- Publication number 20040188498
- Publication date Sep 30, 2004
- PHILIPS CORPORATION
- Eddy W. Vanhoutte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inspection contact sheet and method of fabricating the same
- Publication number 20040101666
- Publication date May 27, 2004
- Dai Nippon Prtg. Co., Ltd.
- Kunihiro Tsubosaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Cabled signaling system and components thereof
- Publication number 20040094328
- Publication date May 20, 2004
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic bus coupling
- Publication number 20030236005
- Publication date Dec 25, 2003
- Yinan Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus, printed wiring board, and connector fixing me...
- Publication number 20030223204
- Publication date Dec 4, 2003
- Kabushiki Kaisha Toshiba
- Masatoshi Tandai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the printed circuits being on the same board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector and electronic device comprising same

Electrical assembly with a multilayer bus board

Plated through hole socketing coupled to a solder ball to engage wi...

Multilayer bus board

Electrical power supply device for at least one LED and at least on...

Electrical interposer

Electronic control connector, electronic control for driving a herm...

Ground routing device and method

Socket pin and semiconductor package test system

Electrical connector with laser soldering and method for assembling...

Jumper module mounting circuit board and circuit board assembly

Magnetic element having improved transformers and common mode chokes

Printed circuits with staggered contact pads and compact component...

Method of manufacturing an interposer

System and method for connecting flat flex cable with an integrated...

System for connecting a camera module, or like device, using flat f...

Method of making electrical connector on a flexible carrier

Cross-connecting by permutations using configurable printed circuits

Slanted vias for electrical circuits on circuit boards and other su...

Combinational jumper wire holder

Suspension with no-solder, no-resin conductor extending through ins...

Electrical connector on a flexible carrier

Jumper chip component and mounting structure therefor

Slanted vias for electrical circuits on circuit boards and other su...

Electromagnetic bus coupling having an electromagnetic coupling int...

Electrical slip ring platter multilayer printed circuit board and m...

Conductive rivet for circuit card

Jumper chip component and mounting structure therefor

Electrically conductive wire

Printed circuit board configuration with a multipole plug-in connector

Patents Applicationslast 30 patents

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

DISPLAY DEVICE

CONNECTOR AND ELECTRONIC DEVICE COMPRISING SAME

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD

MULTILAYER BUS BOARD

GROUND ROUTING DEVICE AND METHOD

Flat Connector and Bulkhead Mounting Structure

Printed Circuits with Staggered Contact Pads and Compact Component...

MAGNETIC ELEMENT HAVING IMPROVED TRANSFORMERS AND COMMOM MODE CHOKES

PROBE AND METHOD FOR MANUFACTURING THE SAME

Method of making electrical connector on a flexible carrier

System and method for connecting flat flx cable with an integrated...

SLANTED VIAS FOR ELECTRICAL CIRCUITS ON CIRCUIT BOARDS AND OTHER SU...

CIRCUIT SUBSTRATE, METHOD FOR INSPECTING ELECTRIC CIRCUIT, AND METH...

Interconnection device for a double-sided printed circuit board

Electronic package connected to a substrate

System for connecting a camera module, or like device, using flat f...

Electrical connector on a flexible carrier

Slanted vias for electrical circuits on circuit boards and other su...

Electrical connector on a flexible carrier

Slanted vias for electrical circuits on circuit boards and other su...

Cross-connecting by permutations using configurable printed circuits

Electrically conductive wire

Jumper chip component and mounting structure therefor

Electrically conductive wire

Inspection contact sheet and method of fabricating the same

Cabled signaling system and components thereof

Electromagnetic bus coupling

Electronic apparatus, printed wiring board, and connector fixing me...