the probes being of different lengths

Industry

CPC
G01R1/07321

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/07321the probes being of different lengths

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,663,487
- Issue date May 26, 2020
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Low force wafer test probe with variable geometry
- Patent number 10,261,108
- Issue date Apr 16, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Grant
Testing head of electronic devices
- Patent number 9,829,508
- Issue date Nov 28, 2017
- Technoprobe S.p.A.
- Stefano Felici
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for selecting the same
- Patent number 8,421,492
- Issue date Apr 16, 2013
- Kabushiki Kaisha Toshiba
- Kazuhito Hayasaka
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional microprobe array
- Patent number 7,946,050
- Issue date May 24, 2011
- National Chiao Tung University
- Jin-Chern Chiou
- G01 - MEASURING TESTING
Information Patent Grant
Resilient probes for electrical testing
- Patent number 7,145,354
- Issue date Dec 5, 2006
- Texas Instruments Incorporated
- Daniel J. Stillman
- G01 - MEASURING TESTING
Information Patent Grant
Device for generating operating states characterized by differences...
- Patent number 5,502,965
- Issue date Apr 2, 1996
- PTS Gesellschaft fuer Physikalisch-Technische Studien Jena mbH
- Henry Hornhauer
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Probe interface assembly
- Patent number 5,144,228
- Issue date Sep 1, 1992
- International Business Machines Corporation
- Michael A. Sorna
- G01 - MEASURING TESTING
Information Patent Grant
Testing device for both-sided contacting of component-equipped prin...
- Patent number 4,841,241
- Issue date Jun 20, 1989
- Siemens Aktiengesellschaft
- Wolfgang Hilz
- G01 - MEASURING TESTING
Information Patent Grant
Spring-stops for a bi-level test fixture
- Patent number 4,626,779
- Issue date Dec 2, 1986
- Pylon Company, Inc.
- Michael C. Boyle
- G01 - MEASURING TESTING
Information Patent Grant
Vacuum actuated bi-level test fixture
- Patent number 4,625,164
- Issue date Nov 25, 1986
- Pylon Company
- Willis E. Golder
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD STRUCTURE
- Publication number 20250004013
- Publication date Jan 2, 2025
- teCat Technologies (Suzhou) Limited
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
PROBE DEVICE, PROBE SYSTEM INCLUDING THE PROBE DEVICE AND OPERATING...
- Publication number 20230400480
- Publication date Dec 14, 2023
- STAR TECHNOLOGIES, INC.
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY
- Publication number 20190195913
- Publication date Jun 27, 2019
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20180286766
- Publication date Oct 4, 2018
- RENESAS ELECTRONICS CORPORATION
- Koji NISHIDA
- G01 - MEASURING TESTING
Information Patent Application
TESTING HEAD OF ELECTRONIC DEVICES
- Publication number 20150309076
- Publication date Oct 29, 2015
- Technoprobe S.p.A.
- Stefano Felici
- G01 - MEASURING TESTING
Information Patent Application
Method for Temporary Electrical Contacting of a Component Arrangeme...
- Publication number 20140354313
- Publication date Dec 4, 2014
- Osram Opto Semiconductors GmbH
- Michael Kuehnelt
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD FOR SELECTING THE SAME
- Publication number 20090289650
- Publication date Nov 26, 2009
- Kabushiki Kaisha Toshiba
- Kazuhito Hayasaka
- G01 - MEASURING TESTING
Information Patent Application
THREE-DIMENSIONAL MICROPROBE ARRAY
- Publication number 20090120216
- Publication date May 14, 2009
- Jin-Chern Chiou
- G01 - MEASURING TESTING
Information Patent Application
JIG FOR PRINTED SUBSTRATE INSPECTION AND PRINTED SUBSTRATE INSPECTI...
- Publication number 20080218188
- Publication date Sep 11, 2008
- Shinko Electric Industries Co., Ltd.
- Koji ARAI
- G01 - MEASURING TESTING
Information Patent Application
RESILIENT PROBES FOR ELECTRICAL TESTING
- Publication number 20060214675
- Publication date Sep 28, 2006
- Daniel J. Stillman
- G01 - MEASURING TESTING
Information Patent Application
Anisotropic probing contactor
- Publication number 20040032271
- Publication date Feb 19, 2004
- Jeffrey E. Blackwood
- G01 - MEASURING TESTING

the probes being of different lengths

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low force wafer test probe with variable geometry

Low force wafer test probe with variable geometry

Testing head of electronic devices

Probe card and method for selecting the same

Three-dimensional microprobe array

Resilient probes for electrical testing

Device for generating operating states characterized by differences...

Probe interface assembly

Testing device for both-sided contacting of component-equipped prin...

Spring-stops for a bi-level test fixture

Vacuum actuated bi-level test fixture

Patents Applicationslast 30 patents

PROBE CARD STRUCTURE

PROBE DEVICE, PROBE SYSTEM INCLUDING THE PROBE DEVICE AND OPERATING...

LOW FORCE WAFER TEST PROBE WITH VARIABLE GEOMETRY

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

TESTING HEAD OF ELECTRONIC DEVICES

Method for Temporary Electrical Contacting of a Component Arrangeme...

PROBE CARD AND METHOD FOR SELECTING THE SAME

THREE-DIMENSIONAL MICROPROBE ARRAY

JIG FOR PRINTED SUBSTRATE INSPECTION AND PRINTED SUBSTRATE INSPECTI...

RESILIENT PROBES FOR ELECTRICAL TESTING

Anisotropic probing contactor