the second connecting process involving a build-up interconnect

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92144the second connecting process involving a build-up interconnect

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Patents Grantslast 30 patents

Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with buffer layer
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- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device comprising solar cell struct...
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- Issue date May 21, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
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- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
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- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
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- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,881,415
- Issue date Jan 23, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
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- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the display device
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- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-embedded substrate and method of making the same
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- Issue date Aug 22, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
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- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging method and fan-out packaging plate
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- Issue date Jul 25, 2023
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
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- Issue date Jul 25, 2023
- Samsung Display Co., Ltd.
- Woong Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,676,944
- Issue date Jun 13, 2023
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
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- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
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Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
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- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the display device
- Patent number 11,380,664
- Issue date Jul 5, 2022
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable electronic package and method of fabricating same
- Patent number 11,309,304
- Issue date Apr 19, 2022
- General Electric Company
- James Sabatini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,189,553
- Issue date Nov 30, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
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- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
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Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
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- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D fanout stacking
- Patent number 11,056,373
- Issue date Jul 6, 2021
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,049,734
- Issue date Jun 29, 2021
- PEP INNOVATION PTE. LTD.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally highly conductive coating on base structure accommodating...
- Patent number 11,051,391
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,024,607
- Issue date Jun 1, 2021
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked-chip package
- Patent number 10,971,417
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,957,671
- Issue date Mar 23, 2021
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
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DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES USING MICROCHANNELS FOR INTERCONNECTIONS
- Publication number 20220367325
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- 3M Innovative Properties Company
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
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- H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE
- Publication number 20220320059
- Publication date Oct 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Ji Hye LEE
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR PRODUCING ELECTRONIC DEVICE
- Publication number 20220173089
- Publication date Jun 2, 2022
- Shin-Etsu Handotai Co., Ltd.
- Junya ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
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Fan-out Packaging Method and Fan-out Packaging Plate
- Publication number 20220051908
- Publication date Feb 17, 2022
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
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WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20220044991
- Publication date Feb 10, 2022
- Amkor Technology Singapore Holding Pte. Ltd
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS
- Publication number 20210358883
- Publication date Nov 18, 2021
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER
- Publication number 20210343549
- Publication date Nov 4, 2021
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20210305064
- Publication date Sep 30, 2021
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE
- Publication number 20210272943
- Publication date Sep 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- Ji Hye LEE
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200303340
- Publication date Sep 24, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20200066623
- Publication date Feb 27, 2020
- J-DEVICES CORPORATION
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200013751
- Publication date Jan 9, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED-CHIP PACKAGE
- Publication number 20190355640
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190311981
- Publication date Oct 10, 2019
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE
- Publication number 20190148282
- Publication date May 16, 2019
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
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- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with EMI protection
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- Publication date Dec 6, 2018
- GE EMBEDDED ELECTRONICS OY
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Information Patent Application
THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
- Publication number 20180323361
- Publication date Nov 8, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Henry L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20180240789
- Publication date Aug 23, 2018
- GENERAL ELECTRIC COMPANY
- James Sabatini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...
- Publication number 20180146559
- Publication date May 24, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES
- Publication number 20180145055
- Publication date May 24, 2018
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20180096924
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method of Forming Substrate Including Embe...
- Publication number 20180053819
- Publication date Feb 22, 2018
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a build-up interconnect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for interconnecting stacked semiconductor devices

Semiconductor device with buffer layer

Method for producing electronic device comprising solar cell struct...

Semiconductor packages using package in package systems and related...

Manufacturing method and electronic module with new routing possibi...

Wiring substrate, semiconductor package having the wiring substrate...

Method of packaging chip and chip package structure

Circuit board structure and method for manufacturing a circuit boar...

Display device and method of fabricating the display device

Electronic-component-embedded substrate and method of making the same

Method for manufacturing an electronic module and electronic module

Fan-out packaging method and fan-out packaging plate

Display device and method of fabricating the same

Method for interconnecting stacked semiconductor devices

Ultra-thin embedded semiconductor device package and method of manu...

Packaged integrated circuit with interposing functionality and meth...

Method for contacting and rewiring an electronic component embedded...

Multi-die package with bridge layer

Display device and method of fabricating the display device

Chip assembling on adhesion layer or dielectric layer, extending be...

Stackable electronic package and method of fabricating same

Wiring substrate, semiconductor package having the wiring substrate...

Power electronics package and method of manufacturing thereof

Circuit board structure and method for manufacturing a circuit boar...

3D fanout stacking

Method of packaging chip and chip package structure

Thermally highly conductive coating on base structure accommodating...

Method for interconnecting stacked semiconductor devices

3D stacked-chip package

Method for fabricating a semiconductor and semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

METHODS AND DEVICES USING MICROCHANNELS FOR INTERCONNECTIONS

Circuits Including Micropatterns and Using Partial Curing to Adhere...

DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE

METHOD FOR PRODUCING ELECTRONIC DEVICE

Fan-out Packaging Method and Fan-out Packaging Plate

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

Circuit board structure and method for manufacturing a circuit boar...

FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS

SEMICONDUCTOR DEVICE WITH BUFFER LAYER

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

Methods for Making Multi-Die Package With Bridge Layer

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

3D STACKED-CHIP PACKAGE

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

Electronic module with EMI protection

THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD

STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME

METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...

METHOD FOR INTERCONNECTING STACKED SEMICONDUCTOR DEVICES

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

Semiconductor Device and Method of Forming Substrate Including Embe...