the second connecting process involving a build-up interconnect

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H01L2224/92244

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92244the second connecting process involving a build-up interconnect

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer light detecting device and electronic apparatus
- Patent number 11,948,833
- Issue date Apr 2, 2024
- Sony Group Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including through via structures
- Patent number 11,923,310
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 11,916,048
- Issue date Feb 27, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,908,783
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,908,795
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,855,030
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,855,018
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 11,854,788
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structures for integrated circuit package
- Patent number 11,848,271
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,848,288
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,837,557
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,817,399
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,798,859
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,935
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096837
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088085
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
- Publication number 20240063048
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240030265
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
- Publication number 20240014142
- Publication date Jan 11, 2024
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20230378075
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor in InFO Structure and Formation Method
- Publication number 20230360426
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY
- Publication number 20230361099
- Publication date Nov 9, 2023
- Jade Bird Display (Shanghai) Limited
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH DUMMY DIE
- Publication number 20230335539
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20230335536
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20230307251
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20230207509
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package Structure and Methods of Forming Same
- Publication number 20230154896
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
- Publication number 20230114652
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20230112750
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
- Publication number 20230096463
- Publication date Mar 30, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages
- Publication number 20230075602
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20220415856
- Publication date Dec 29, 2022
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20220375886
- Publication date Nov 24, 2022
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367306
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin CHEN
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a build-up interconnect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out package having a main die and a dummy die

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structures and method of forming the same

Multilayer light detecting device and electronic apparatus

Semiconductor package and method

Method of forming device and package structure

3D-interconnect

Package structure including through via structures

Light emitting device reflective bank structure

Method for fabricating a chip package

Wiring substrate, semiconductor package having the wiring substrate...

Package structures and method of forming the same

Contact pad for semiconductor device

Semiconductor device encapsulated by molding material attached to r...

Package structure and method of manufacturing the same

Semiconductor device and method of manufacture

Metal oxide layered structure and methods of forming the same

Micro assembled LED displays and lighting elements

Semiconductor device and manufacturing method of the same

Redistribution layer structures for integrated circuit package

Semiconductor device and method

Semiconductor package and manufacturing method thereof

Method of forming semiconductor packages having through package vias

Semiconductor device package and a method of manufacturing the same

Lead between a plurality of encapsulated MOSFETs

Semiconductor device

Package structure and manufacturing method thereof

Electronic device package and method of manufacturing the same

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE

STACKED CHIP SCALE OPTICAL SENSOR PACKAGE

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Component Carrier With Electronic Components and Thermally Conducti...

Method of Forming Semiconductor Packages Having Through Package Vias

Fingerprint Sensor in InFO Structure and Formation Method

LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY

Process Including a Re-etching Process for Forming a Semiconductor...

Fingerprint Sensor Device and Method

PACKAGE STRUCTURE WITH DUMMY DIE

Semiconductor Packages and Methods of Forming the Same

Semiconductor Device

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

3D Package Structure and Methods of Forming Same

Integrated Fan-Out Package and the Methods of Manufacturing

Contact Pad for Semiconductor Device

Semiconductor Device and Method of Forming Dual-Sided Interconnect...

Semiconductor Packages

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

Antenna in Embedded Wafer-Level Ball-Grid Array Package

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME