the second connecting process involving a build-up interconnect

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H01L2224/92244

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92244the second connecting process involving a build-up interconnect

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device having improved reliability and inspe...
- Patent number 12,183,707
- Issue date Dec 31, 2024
- STMicroelectronics S.r.l.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,100,665
- Issue date Sep 24, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,728
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and tiled display comprising the same
- Patent number 12,063,832
- Issue date Aug 13, 2024
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,058,101
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 12,033,910
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, method of forming a pattern and m...
- Patent number 12,013,645
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395566
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240365623
- Publication date Oct 31, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...
- Publication number 20240288776
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christine Y. Ouyang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20240266298
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
- Publication number 20240234385
- Publication date Jul 11, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING TH...
- Publication number 20240237454
- Publication date Jul 11, 2024
- InnoLux Corporation
- Shun-Yuan HU
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS
- Publication number 20240213167
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178133
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20240178057
- Publication date May 30, 2024
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20240153872
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
- Publication number 20240145429
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Riccardo VILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a build-up interconnect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged semiconductor device having improved reliability and inspe...

Semiconductor device with lead between a plurality of encapsulated...

Semiconductor packages

Seamless interconnect thresholds using dielectric fluid channels

Integrated fan-out package and the methods of manufacturing

Package structure with fan-out feature

Method of manufacturing semiconductor structure

Method of forming semiconductor packages having through package vias

Semiconductor package structure and manufacturing method thereof

Semiconductor device

Antenna in embedded wafer-level ball-grid array package

Method of manufacturing an integrated fan-out package having fan-ou...

Formation method of chip package with fan-out structure

Micro assembled LED displays and lighting elements

Package structure with through via extending through redistribution...

Semiconductor device and corresponding method of manufacture

Light-emitting device and tiled display comprising the same

Integrated fan-out packaging

Package structure and method of forming the same

Integrated circuit packages

Semiconductor package having a through intervia through the molding...

Wafer-level stack chip package and method of manufacturing the same

Fan-out interconnect structure and methods forming the same

Semiconductor device, endoscope, and method for manufacturing semic...

Fan-out structure and method of fabricating the same

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor package and method of forming the same

Method for removing resist layer, method of forming a pattern and m...

3D package structure and methods of forming same

Package structure and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Fingerprint Sensor Device and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...

PACKAGE STRUCTURE

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

METHOD OF FORMING PACKAGE STRUCTURE

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING TH...

PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME