the second connecting process involving a build-up interconnect

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H01L2224/92124

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92124the second connecting process involving a build-up interconnect

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
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Information Patent Grant
System on integrated chips and methods of forming same
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- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules formed using wafer-level processing of a reconst...
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- Issue date Jul 12, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and methods of forming same
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- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that uses bonding layer to join semiconductor...
- Patent number 11,088,131
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
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- Issue date Jul 20, 2021
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- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
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- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
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- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
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- Issue date Feb 23, 2021
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- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wafer level package for a mems sensor device and corresponding manu...
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- Issue date Jan 5, 2021
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 10,784,178
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device that uses bonding laye...
- Patent number 10,727,217
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,424,563
- Issue date Sep 24, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and methods of forming same
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- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless integrated circuit packages and methods of forming same
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- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company
- Lin-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit structure and method of forming
- Patent number 10,163,856
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,157,900
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device and the semiconductor...
- Patent number 10,128,153
- Issue date Nov 13, 2018
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,115,650
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
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- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...
- Publication number 20240162180
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
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- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
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MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
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- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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- Publication number 20220246598
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20220246581
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220068867
- Publication date Mar 3, 2022
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device that Uses Bonding Layer to Join Semiconductor...
- Publication number 20210366893
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20210242173
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020535
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- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device that Uses Bonding Laye...
- Publication number 20200328200
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
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- Invensas Corporation
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Information Patent Application
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- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming Same
- Publication number 20190341376
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Structure and Method of Forming
- Publication number 20190115320
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
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Information Patent Application
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- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
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Substrateless Integrated Circuit Packages and Methods of Forming Same
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STACKED FAN-OUT SEMICONDUCTOR CHIP
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Information Patent Application
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- STATS ChipPAC, Ltd.
- Reza A. Pagaila
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Information Patent Application
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- STATS ChipPAC, Ltd.
- Reza A. Pagaila
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Information Patent Application
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- IBIDEN CO., LTD.
- Takashi KARIYA
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a build-up interconnect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer-level stack chip package and method of manufacturing the same

Electronic package including electronic structure and electronic co...

System on integrated chips and methods of forming same

Die-on-interposer assembly with dam structure and method of manufac...

Multi-chip modules formed using wafer-level processing of a reconst...

Wafer level integration including design/co-design, structure proce...

Semiconductor packages including routing dies and methods of formin...

Integrated circuit package and methods of forming same

Semiconductor device that uses bonding layer to join semiconductor...

System on integrated chips and methods of forming same

Stacked integrated circuit structure and method of forming

Stacked integrated circuit structure and method of forming

Electronic module and method for producing same

Wafer level package for a mems sensor device and corresponding manu...

Wafer-level stack chip package and method of manufacturing the same

Die-on-interposer assembly with dam structure and method of manufac...

Method of manufacturing semiconductor device that uses bonding laye...

Electronics package having a self-aligning interconnect assembly an...

Wafer level integration including design/co-design, structure proce...

System on integrated chips and methods of forming same

Die-on-interposer assembly with dam structure and method of manufac...

Multichip modules and methods of fabrication

Semiconductor package assembly and method for forming the same

Integrated circuit package and methods of forming same

Substrateless integrated circuit packages and methods of forming same

Stacked integrated circuit structure and method of forming

Multichip modules and methods of fabrication

Semiconductor structure and manufacturing method thereof

Method of fabricating a semiconductor device and the semiconductor...

Die-on-interposer assembly with dam structure and method of manufac...

Patents Applicationslast 30 patents

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

Semiconductor Devices and Methods of Manufacture

Stacked Integrated Circuit Structure and Method of Forming

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device that Uses Bonding Layer to Join Semiconductor...

System on Integrated Chips and Methods of Forming Same

Stacked Integrated Circuit Structure and Method of Forming

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing Semiconductor Device that Uses Bonding Laye...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

Stacked Integrated Circuit Structure and Method of Forming

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

Integrated Circuit Package and Methods of Forming Same

Stacked Integrated Circuit Structure and Method of Forming

MULTICHIP MODULES AND METHODS OF FABRICATION

System on Integrated Chips and Methods of Forming Same

Substrateless Integrated Circuit Packages and Methods of Forming Same

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

Integrated Circuit Packages and Methods of Forming Same

Semiconductor Device and Method of Forming WLCSP with Semiconductor...

STACKED FAN-OUT SEMICONDUCTOR CHIP

MICROELECTRONIC ASSEMBLY TOLERANT TO MISPLACEMENT OF MICROELECTRONI...

Semiconductor Device and Method of Forming Different Height Conduct...

Semiconductor Device and Method of Forming Different Height Conduct...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME