the second connecting process involving a bump connector

Industry

CPC
H01L2224/92163

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92163the second connecting process involving a bump connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,302,644
- Issue date Apr 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 10,615,154
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly semiconductor device with through-package interc...
- Patent number 9,978,730
- Issue date May 22, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame electri...
- Patent number 9,966,335
- Issue date May 8, 2018
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant circuit including bump pads
- Patent number 9,929,123
- Issue date Mar 27, 2018
- Analog Devices, Inc.
- Cemin Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having cascaded chip stack
- Patent number 9,553,074
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a lead, package-on-package device includ...
- Patent number 9,543,275
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Yun-rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with package interconnect extending i...
- Patent number 9,508,686
- Issue date Nov 29, 2016
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies with wire bonds and method
- Patent number 9,508,703
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,190,354
- Issue date Nov 17, 2015
- SOCIONEXT INC.
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type power device module
- Patent number 9,142,473
- Issue date Sep 22, 2015
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,980,692
- Issue date Mar 17, 2015
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame electri...
- Patent number 8,932,907
- Issue date Jan 13, 2015
- STATS ChipPAC, Ltd.
- NamJu Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,664,775
- Issue date Mar 4, 2014
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face (F2F) hybrid structure for an integrated circuit
- Patent number 8,637,983
- Issue date Jan 28, 2014
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,410,598
- Issue date Apr 2, 2013
- STMicroeletronics Pte. Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame electri...
- Patent number 8,384,227
- Issue date Feb 26, 2013
- STATS ChipPAC, Ltd.
- NamJu Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module having discrete components and method for prod...
- Patent number 7,795,727
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating wafer-level package
- Patent number 6,043,109
- Issue date Mar 28, 2000
- United Microelectronics Corp.
- Te-Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210202393
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20200243493
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20180226387
- Publication date Aug 9, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140217567
- Publication date Aug 7, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20140197526
- Publication date Jul 17, 2014
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140187000
- Publication date Jul 3, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE POWER DEVICE MODULE
- Publication number 20140159212
- Publication date Jun 12, 2014
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
- Publication number 20130099378
- Publication date Apr 25, 2013
- STATS ChipPAC, Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Stud Bump Wafer Level Package
- Publication number 20130087915
- Publication date Apr 11, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130032942
- Publication date Feb 7, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING...
- Publication number 20120168929
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
- Publication number 20120119388
- Publication date May 17, 2012
- STATS ChipPAC, Ltd.
- NamJu Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT
- Publication number 20100155938
- Publication date Jun 24, 2010
- ATI Technologies ULC
- Liane Martinez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...
- Publication number 20070235865
- Publication date Oct 11, 2007
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the second connecting process involving a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die package with bridge layer

Semiconductor device assembly with through-package interconnect and...

Chip package structure and manufacturing method thereof

Semiconductor package structure and method for manufacturing the same

Methods for making multi-die package with bridge layer

Semiconductor device assembly with through-package interconnect and...

Method of assembly semiconductor device with through-package interc...

Semiconductor device and method of forming interposer frame electri...

Resonant circuit including bump pads

Multi-die package with bridge layer and method for making the same

Semiconductor package having cascaded chip stack

Semiconductor package with a lead, package-on-package device includ...

Semiconductor device assembly with package interconnect extending i...

Stacked dies with wire bonds and method

Semiconductor device and manufacturing method of the same

Stacked type power device module

Semiconductor device manufacturing method

Semiconductor device and method of forming interposer frame electri...

Semiconductor device

Face-to-face (F2F) hybrid structure for an integrated circuit

Semiconductor package and method of manufacturing the same

Semiconductor device and method of forming interposer frame electri...

Semiconductor module having discrete components and method for prod...

Method of fabricating wafer-level package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STACKED TYPE POWER DEVICE MODULE

Semiconductor Device and Method of Forming Interposer Frame Electri...

Copper Stud Bump Wafer Level Package

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING...

Semiconductor Device and Method of Forming Interposer Frame Electri...

FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...