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the second connecting process involving a bump connector
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CPC
H01L2224/92153
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/92153
the second connecting process involving a bump connector
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Patent Application
METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...
Publication number
20250112214
Publication date
Apr 3, 2025
Audi AG
Daniel RUPPERT
H01 - BASIC ELECTRIC ELEMENTS