the second connecting process involving a layer connector

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H01L2224/92165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92165the second connecting process involving a layer connector

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the second connecting process involving a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Magnetic memory device

Measuring device

Semiconductor package and fabrication method thereof

Semiconductor device

Stacking arrangement for integration of multiple integrated circuits

Packaging structure for thin die and method for manufacturing the same

Semiconductor module package and method of manufacturing the same

Semiconductor device including semiconductor chips stacked via rela...

Wirebond recess for stacked die

Adhesive composition for semiconductor and adhesive film comprising...

Semiconductor device including a contact clip having protrusions an...

High density chip stacked package, package-on-package and method of...

Integrated circuit packaging system with stiffener and method of ma...

Semiconductor package device with a heat dissipation structure and...

High performance chip scale leadframe package with thermal dissipat...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STIFFENER AND METHOD OF MA...

Semiconductor Device Including a Contact Clip Having Protrusions an...

DIE-BONDING FILM AND USE THEREOF

Semiconductor package device with a heat dissipation structure and...

HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...

High performance chip scale leadframe with t-shape die pad and meth...

High performance chip scale leadframe package and method of manufac...