the second connecting process involving a layer connector

Industry

CPC
H01L2224/92135

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92135the second connecting process involving a layer connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out stacked package with fan-out redistribution laye...
- Patent number 11,538,788
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 11,532,594
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of manufacturing the same
- Patent number 9,343,439
- Issue date May 17, 2016
- SK hynix Inc.
- Jin Ho Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of manufacturing the same
- Patent number 9,196,607
- Issue date Nov 24, 2015
- SK Hynix Inc.
- Jin Ho Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with active surface heat remova...
- Patent number 8,421,212
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor packaging method and structure
- Patent number 7,262,444
- Issue date Aug 28, 2007
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
- Publication number 20230114652
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20230057113
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20140361441
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...
- Publication number 20120068328
- Publication date Mar 22, 2012
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND...
- Publication number 20090115042
- Publication date May 7, 2009
- ZYCUBE CO., LTD.
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPON...
- Publication number 20080318413
- Publication date Dec 25, 2008
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT
- Publication number 20080318054
- Publication date Dec 25, 2008
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor packaging method and structure
- Publication number 20070040186
- Publication date Feb 22, 2007
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package and the methods of manufacturing

Package structure and method of forming the same

Semicondutor package substrate with die cavity and redistribution l...

Integrated fan-out stacked package with fan-out redistribution laye...

Integrated fan-out package and the methods of manufacturing

Bump package and methods of formation thereof

Stack packages and methods of manufacturing the same

Stack packages and methods of manufacturing the same

Integrated circuit packaging system with active surface heat remova...

Power semiconductor packaging method and structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Integrated Fan-Out Package and the Methods of Manufacturing

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

Bump Package and Methods of Formation Thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND...

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPON...

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Power semiconductor packaging method and structure