the second connecting process involving a strap connector

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H01L2224/92166

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92166the second connecting process involving a strap connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die being connected with a clip and a wire which is p...
- Patent number 12,068,274
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices
- Patent number 11,031,379
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,076,782
- Issue date Jul 7, 2015
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a contact clip having protrusions an...
- Patent number 8,987,879
- Issue date Mar 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Semiconductor Device
- Publication number 20240404983
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die being Connected with a Clip and a Wire which is P...
- Publication number 20210175200
- Publication date Jun 10, 2021
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20210066256
- Publication date Mar 4, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS