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the second connecting process involving a strap connector
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CPC
H01L2224/92136
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/92136
the second connecting process involving a strap connector
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Patents Grants
last 30 patents
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Patent Grant
Package-in-packages and methods of formation thereof
Patent number
9,147,628
Issue date
Sep 29, 2015
Infineon Technoloiges Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Package-In-Packages and Methods of Formation Thereof
Publication number
20140001615
Publication date
Jan 2, 2014
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS