the second connecting process involving a strap connector

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H01L2224/92246

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92246the second connecting process involving a strap connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with solder standoff
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- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
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- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split tie bar for clip stability
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- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
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- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
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- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
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- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
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- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
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- Issue date Aug 10, 2021
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
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- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
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- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid top terminal for discrete power devices
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- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a heat spreader and method of manufactur...
- Patent number 10,658,277
- Issue date May 19, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,491
- Issue date Nov 26, 2019
- Mitsubishi Electric Corporation
- Kazuhiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,438,870
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Boon Teik Tee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holes and dimples to control solder flow
- Patent number 9,911,684
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...
- Publication number 20240274572
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
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METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...
- Publication number 20240250005
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- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES
- Publication number 20240047317
- Publication date Feb 8, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230369279
- Publication date Nov 16, 2023
- STMicroelectronics S.r.l
- Thomas GOTTARDI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
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SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230245954
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Koshun SAITO
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230245994
- Publication date Aug 3, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
- Publication number 20220406679
- Publication date Dec 22, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT TIE BAR FOR CLIP STABILITY
- Publication number 20220344302
- Publication date Oct 27, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20210327846
- Publication date Oct 21, 2021
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
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- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
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Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
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- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG CLIP
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- TEXAS INSTRUMENTS INCORPORATED
- Michael Kirby Chua Quijano
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Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
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- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
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- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20200118963
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- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
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Method of Manufacturing a Multi-Chip Semiconductor Power Device
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- Publication date Mar 12, 2020
- Ralf Otremba
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Information Patent Application
Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit...
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- Boon Teik Tee
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SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLES AND DIMPLES TO CONTROL SOLDER FLOW
- Publication number 20180053712
- Publication date Feb 22, 2018
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
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- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
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Information Patent Application
Electronic module comprising fluid cooling channel and method of ma...
- Publication number 20160322333
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a strap connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with solder standoff

Stack of electrical components and method of producing the same

Split tie bar for clip stability

Semiconductor device

Power module package and method of manufacturing the same

Plurality of heat sinks for a semiconductor package

Soldering a conductor to an aluminum metallization

Batch manufacture of packages by sheet separated into carriers afte...

Semiconductor package with solder standoff

Stack of electrical components and method of producing the same

Semiconductor device

Power module package

Semiconductor device packaging assembly, lead frame strip and unit...

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Solid top terminal for discrete power devices

Die stack assembly using an edge separation structure for connectiv...

Semiconductor device and method with clip arrangement in IC package

Die stack assembly using an edge separation structure for connectiv...

Semiconductor package with a heat spreader and method of manufactur...

Soldering a conductor to an aluminum metallization

Method for fabricating stack die package

Semiconductor device

Semiconductor module and conductive member for semiconductor module...

Semiconductor device packaging assembly, lead frame strip and unit...

Clip and related methods

Electronic module comprising fluid cooling channel and method of ma...

Semiconductor device

Semiconductor module bonding wire connection method

Holes and dimples to control solder flow

Patents Applicationslast 30 patents

POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...

METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANU...

PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET

Method for Producing Power Semiconductor Module and Power Semicondu...

SPLIT TIE BAR FOR CLIP STABILITY

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

GANG CLIP

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

CLIP AND RELATED METHODS

HOLES AND DIMPLES TO CONTROL SOLDER FLOW

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

Electronic module comprising fluid cooling channel and method of ma...