the second connecting process involving a TAB connector

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H01L2224/92148

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92148the second connecting process involving a TAB connector

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing mounting structure for electronic componen...
- Patent number 11,881,470
- Issue date Jan 23, 2024
- Japan Aviation Electronics Industry, Limited
- Ryosuke Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...
- Publication number 20210193612
- Publication date Jun 24, 2021
- Japan Aviation Electronics Industry, Limited
- Ryosuke MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packaging for avoiding metal contamination
- Publication number 20070092993
- Publication date Apr 26, 2007
- Elpida Memory, Inc.
- Kiyonori Oyu
- H01 - BASIC ELECTRIC ELEMENTS