the second connecting process involving a wire connector

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H01L2224/92137

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92137the second connecting process involving a wire connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic field sensor and method for making same
- Patent number 11,067,643
- Issue date Jul 20, 2021
- Melexis Technologies NV
- Christian Schott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic field sensor and method for making same
- Patent number 10,620,277
- Issue date Apr 14, 2020
- Melexis Technologies NV
- Christian Schott
- G01 - MEASURING TESTING
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220108973
- Publication date Apr 7, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS