the second connecting process involving a wire connector

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H01L2224/92157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92157the second connecting process involving a wire connector

Industries

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the second connecting process involving a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly and method therefor

Semiconductor devices and methods of making the same

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Semiconductor devices and methods of making the same

Semiconductor device

Semiconductor module package and method of manufacturing the same

Stacked synchronous buck converter having chip embedded in outside...

Semiconductor device

Semiconductor device including a contact clip having protrusions an...

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Power package module with low and high power chips and method for f...

Semiconductor device attached to island having protrusion

Patents Applicationslast 30 patents

CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE

HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

Lead Frame Packages and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

Semiconductor Device Including a Contact Clip Having Protrusions an...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME