the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art

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H01L2924/00015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/00015the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,244,926
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Young-Hoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making integrated circuit packages
- Patent number 11,152,324
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 11,121,021
- Issue date Sep 14, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 10,504,751
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier output circuit device with integrated current path, an...
- Patent number 10,432,152
- Issue date Oct 1, 2019
- NXP USA, INC.
- Michael E. Watts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electronic package
- Patent number 10,224,243
- Issue date Mar 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device
- Patent number 10,122,837
- Issue date Nov 6, 2018
- HTC Corporation
- Tiao-Hsing Tsai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Package structures and method of forming the same
- Patent number 10,032,651
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation of bondwires in the microwave regime
- Patent number 10,014,276
- Issue date Jul 3, 2018
- The United States of America, as represented by the Secretary of the Navy
- Jia-Chi Samuel Chieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding with silver paste
- Patent number 9,972,597
- Issue date May 15, 2018
- Hyundai Motor Company
- Kyoung-Kook Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...
- Publication number 20190148306
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20190006222
- Publication date Jan 3, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA
- Publication number 20180211916
- Publication date Jul 26, 2018
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...
- Publication number 20180130767
- Publication date May 10, 2018
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE
- Publication number 20180068896
- Publication date Mar 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
- Publication number 20180033758
- Publication date Feb 1, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Roxanna Bauzon Samson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140332583
- Publication date Nov 13, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIOXIDANT GAS SUPPLY UNIT
- Publication number 20140311590
- Publication date Oct 23, 2014
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140179063
- Publication date Jun 26, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140151341
- Publication date Jun 5, 2014
- SHINKAWA LTD.
- Katsutoshi KUNIYOSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140097004
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...
- Publication number 20140090876
- Publication date Apr 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE

the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Multilayer substrate

Semiconductor package and manufacturing method thereof

Method and apparatus for making integrated circuit packages

3D semiconductor device and structure

Semiconductor packages with an intermetallic layer

Solid top terminal for discrete power devices

Metal bonding pads for packaging applications

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Semiconductor device with barrier layer

Method for fabricating stack die package

Package structures and method of forming the same

RF amplifier output circuit device with integrated current path, an...

Method for manufacturing semiconductor apparatus, method for manufa...

Semiconductor chip mounted on a packaging substrate

Metal bonding pads for packaging applications

Dual lead frame semiconductor package and method of manufacture

Method of fabricating electronic package

Multilayer substrate

Electronic device and method for producing an electronic device

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Wireless communication device

Package structures and method of forming the same

Compensation of bondwires in the microwave regime

Bonding structure for semiconductor package and method of manufactu...

Method of bonding with silver paste

Aluminum coated copper bond wire and method of making the same

Method and apparatus for printing integrated circuit bond connections

Resin sealing type semiconductor device and method of manufacturing...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...

3D SEMICONDUCTOR DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE AND BALL BONDER

Window Clamp

Window Clamp

METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA

METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH SIDEWALL RECESS AND REL...

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

METHOD OF FABRICATING ELECTRONIC PACKAGE

3D Printed Hermetic Package Assembly and Method

Remapped Packaged Extracted Die with 3D Printed Bond Connections

METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

WIRE BONDING APPARATUS

Dual Lead Frame Semiconductor Package and Method of Manufacture

ANTIOXIDANT GAS SUPPLY UNIT

METHOD FOR FABRICATING STACK DIE PACKAGE

Method and apparatus for printing integrated circuit bond connections

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

WIRE BONDING APPARATUS

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...

METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAIN...