the substrate being a semiconductor body

Industry

CPC
H01L21/784

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/784the substrate being a semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of processing workpiece and laser processing apparatus
- Patent number 12,121,993
- Issue date Oct 22, 2024
- Disco Corporation
- Masatoshi Nayuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturable large area gallium and nitrogen containin...
- Patent number 11,949,212
- Issue date Apr 2, 2024
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 11,887,858
- Issue date Jan 30, 2024
- Kabushiki Kaisha Toshiba
- Shinji Nunotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing silicon carbide semiconductor device
- Patent number 11,869,814
- Issue date Jan 9, 2024
- Fuji Electric Co., Ltd.
- Hidetatsu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,855,007
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods including patterns in scribe regions of sem...
- Patent number 11,810,822
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 11,764,110
- Issue date Sep 19, 2023
- Semiconductor Components Industries, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,424,322
- Issue date Aug 23, 2022
- Denso Corporation
- Tatsuji Nagaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor module and method of manufacturing gas sensor module
- Patent number 11,415,536
- Issue date Aug 16, 2022
- Nissha Co., Ltd.
- Teppei Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,387,205
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,348,879
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 11,342,426
- Issue date May 24, 2022
- Kabushiki Kaisha Toshiba
- Shinji Nunotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for manufacturing capacitor
- Patent number 11,145,711
- Issue date Oct 12, 2021
- Murata Manufacturing Co., Ltd.
- Tomoyuki Ashimine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating packaged integrated circuits and resulting s...
- Patent number 10,964,595
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for manufacturable large area gallium and nitr...
- Patent number 10,903,623
- Issue date Jan 26, 2021
- Soraa Laser Diode, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package comprising the same
- Patent number 10,886,234
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Jun Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,564
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device and a semiconductor d...
- Patent number 10,825,734
- Issue date Nov 3, 2020
- 3-5 Power Electronics GmbH
- Volker Dudek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 10,818,612
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated elastomeric interface layer formation and singulation fo...
- Patent number 10,763,135
- Issue date Sep 1, 2020
- Facebook Technologies, LLC
- Pooya Saketi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 10,685,936
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar-CMOS-DMOS semiconductor device and manufacturing method
- Patent number 10,607,987
- Issue date Mar 31, 2020
- University of Electronic Science and Technology of China
- Ming Qiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Publication number 20250006607
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE
- Publication number 20240387300
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOUBLE-GATE STRUCTURE AND METHOD OF MAN...
- Publication number 20240372009
- Publication date Nov 7, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321955
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240249987
- Publication date Jul 25, 2024
- Kabushiki Kaisha Toshiba
- Shunsuke KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240162092
- Publication date May 16, 2024
- DENSO CORPORATION
- YUJI NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SEPARATING SEMICONDUCTOR DIES
- Publication number 20240071828
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240071908
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240063059
- Publication date Feb 22, 2024
- RENESAS ELECTRONICS CORPORATION
- Koichi ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTO...
- Publication number 20230392043
- Publication date Dec 7, 2023
- Shigeki KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
- Publication number 20230377972
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...
- Publication number 20230377974
- Publication date Nov 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT
- Publication number 20230343578
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Minoru NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20230326895
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-ASSISTED DIE EJECTION SYSTEM
- Publication number 20230317500
- Publication date Oct 5, 2023
- Intel Corporation
- Chetan Harsha EDARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230268230
- Publication date Aug 24, 2023
- DENSO CORPORATION
- FUMIHITO TACHIBANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION
- Publication number 20230245928
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeniffer ASPURIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE
- Publication number 20230238281
- Publication date Jul 27, 2023
- DENSO CORPORATION
- MASATAKE NAGAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230207392
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP ASSEMBLY AND METHODS OF PRODUCING MULTI-CHIP ASSEMBLIES
- Publication number 20230145931
- Publication date May 11, 2023
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...
- Publication number 20230130979
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230095477
- Publication date Mar 30, 2023
- DENSO CORPORATION
- KOZO KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230097227
- Publication date Mar 30, 2023
- Kabushiki Kaisha Toshiba
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS

the substrate being a semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing workpiece and laser processing apparatus

Method for manufacturable large area gallium and nitrogen containin...

Backmetal removal methods

Semiconductor device and method of manufacturing same

Method of manufacturing silicon carbide semiconductor device

Semiconductor structure

Semiconductor die connection system and method

Apparatuses and methods including patterns in scribe regions of sem...

Moat coverage with dielectric film for device passivation and singu...

Forming recesses in molding compound of wafer to reduce stress

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Gas sensor module and method of manufacturing gas sensor module

Semiconductor die connection system and method

Semiconductor structure

Semiconductor device and method of manufacturing same

Capacitor and method for manufacturing capacitor

Semiconductor device and method of manufacturing a semiconductor de...

Method for singulating packaged integrated circuits and resulting s...

Method and structure for manufacturable large area gallium and nitr...

Semiconductor device and semiconductor package comprising the same

Semiconductor device and manufacturing method thereof

Method for fabricating a semiconductor device and a semiconductor d...

Manufacturing method of semiconductor structure

Semiconductor device and method of forming embedded wafer level chi...

Systems and methods for electromagnetic interference shielding

Integrated elastomeric interface layer formation and singulation fo...

Forming recesses in molding compound of wafer to reduce stress

Bipolar-CMOS-DMOS semiconductor device and manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE HAVING DOUBLE-GATE STRUCTURE AND METHOD OF MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

METHODS OF SEPARATING SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SLURRY, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTO...

DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO

MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...

CHIP BONDING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT

Semiconductor Die Connection System and Method

HEAT-ASSISTED DIE EJECTION SYSTEM

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Forming Recesses in Molding Compound of Wafer to Reduce Stress

TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

MULTI-CHIP ASSEMBLY AND METHODS OF PRODUCING MULTI-CHIP ASSEMBLIES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME