the substrate being a semiconductor, using silicon technology

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/822the substrate being a semiconductor, using silicon technology

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,963,374
- Issue date Apr 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor device with nanostructure channels and manufa...
- Patent number 11,955,384
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a PNP bipolar transistor and NPN bipolar transist...
- Patent number 11,955,481
- Issue date Apr 9, 2024
- STMicroelectronics (Crolles 2) SAS
- Jean Jimenez Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with transistors
- Patent number 11,956,976
- Issue date Apr 9, 2024
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact resistance for stacked FET devices
- Patent number 11,948,944
- Issue date Apr 2, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,950,399
- Issue date Apr 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage electrostatic discharge devices
- Patent number 11,942,472
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kyong Jin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 11,943,939
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array test structure and method of forming the same
- Patent number 11,935,624
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrostatic discharge protection circuit having a metal connectio...
- Patent number 11,929,305
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
- Patent number 11,923,355
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral bipolar junction transistors with a back-gate
- Patent number 11,923,417
- Issue date Mar 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC power grid
- Patent number 11,923,271
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Noor E. V. Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,916,054
- Issue date Feb 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,917,838
- Issue date Feb 27, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a wrap-around contact to connect a source or drain epitaxia...
- Patent number 11,915,984
- Issue date Feb 27, 2024
- Synopsys, Inc.
- Xi-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,916,056
- Issue date Feb 27, 2024
- SOCIONEXT INC.
- Junji Iwahori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked complementary field effect transistors
- Patent number 11,916,073
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,915,928
- Issue date Feb 27, 2024
- Kioxia Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-N multichip modules and methods of fabrication
- Patent number 11,908,687
- Issue date Feb 20, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having merged epitaxial features with arc-like...
- Patent number 11,908,742
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basic logic element, semiconductor device including the same, outpu...
- Patent number 11,899,062
- Issue date Feb 13, 2024
- NEC Space Technologies, Ltd.
- Hiroki Hihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for reading data of a first memory cell transistor of a nonv...
- Patent number 11,903,205
- Issue date Feb 13, 2024
- Kioxia Corporation
- Masaru Kito
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,901,364
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for writing data of a first memory cell transistor of a nonv...
- Patent number 11,903,207
- Issue date Feb 13, 2024
- Kioxia Corporation
- Masaru Kito
- G11 - INFORMATION STORAGE
Information Patent Grant
Architecture design and process for manufacturing monolithically in...
- Patent number 11,901,360
- Issue date Feb 13, 2024
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,903,210
- Issue date Feb 13, 2024
- Kioxia Corporation
- Tetsuaki Utsumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Multiple nano layer transistor layers with different transistor arc...
- Patent number 11,894,378
- Issue date Feb 6, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED FIELD EFFECT TRANSISTOR STRUCTURE WITH INDEPENDENT GATE CON...
- Publication number 20240145473
- Publication date May 2, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240145474
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Kyung ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240145316
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR INTEGRATION
- Publication number 20240136357
- Publication date Apr 25, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD TH...
- Publication number 20240138150
- Publication date Apr 25, 2024
- KIOXIA Corporation
- Masaru KITO
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR FORMING STACKED TRANSISTOR DEVICES
- Publication number 20240128124
- Publication date Apr 18, 2024
- IMEC vzw
- Sujith Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
- Publication number 20240120312
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBS...
- Publication number 20240112056
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Vivekananda P. Adiga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL INVERTER FORMATION ON STACKED FIELD EFFECT TRANSISTOR (SFET)
- Publication number 20240113117
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240113346
- Publication date Apr 4, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Junpei MOMO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...
- Publication number 20240105724
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- DONGHOON HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SINGULATION OF DIES FROM A WAFER
- Publication number 20240105514
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Randolph Estal Flauta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20240100632
- Publication date Mar 28, 2024
- Disco Corporation
- Jingshi CHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240105490
- Publication date Mar 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD
- Publication number 20240105513
- Publication date Mar 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET
- Publication number 20240096887
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Ruqiang BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...
- Publication number 20240096889
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Seung Min Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096879
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Kyu Man HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
- Publication number 20240096884
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20240088120
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Walls for Complementary Field Effect Transistors
- Publication number 20240072052
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING STACKED NANOSHEET TRANSISTORS
- Publication number 20240072060
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- BYOUNGHAK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate All-Around (GAA) Field Effect Transistors (FETS) Formed on Bot...
- Publication number 20240072070
- Publication date Feb 29, 2024
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF
- Publication number 20240072054
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH DUAL POWER AND SIGNAL LINES
- Publication number 20240071926
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20240063123
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS

the substrate being a semiconductor, using silicon technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Stacked semiconductor device with nanostructure channels and manufa...

Device comprising a PNP bipolar transistor and NPN bipolar transist...

3D semiconductor devices and structures with transistors

Optimized contact resistance for stacked FET devices

Bonded semiconductor devices having processor and static random-acc...

High-voltage electrostatic discharge devices

Integrated circuit device and method

Memory array test structure and method of forming the same

Electrostatic discharge protection circuit having a metal connectio...

Deep trench capacitor fuse structure for high voltage breakdown def...

Lateral bipolar junction transistors with a back-gate

3D IC power grid

3D semiconductor device and structure with bonding

Stacked devices and methods of fabrication

Semiconductor device

Forming a wrap-around contact to connect a source or drain epitaxia...

Semiconductor integrated circuit device

Stacked complementary field effect transistors

Semiconductor memory device and method of manufacturing the same

III-N multichip modules and methods of fabrication

Semiconductor device having merged epitaxial features with arc-like...

3D semiconductor device and structure with memory

Basic logic element, semiconductor device including the same, outpu...

Method for reading data of a first memory cell transistor of a nonv...

Semiconductor device structure and methods of forming the same

Method for writing data of a first memory cell transistor of a nonv...

Architecture design and process for manufacturing monolithically in...

Semiconductor memory device

Multiple nano layer transistor layers with different transistor arc...

Patents Applicationslast 30 patents

STACKED FIELD EFFECT TRANSISTOR STRUCTURE WITH INDEPENDENT GATE CON...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

OPTIMIZATION OF VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR INTEGRATION

NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD TH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

METHODS FOR FORMING STACKED TRANSISTOR DEVICES

SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBS...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

VERTICAL INVERTER FORMATION ON STACKED FIELD EFFECT TRANSISTOR (SFET)

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...

METHOD OF SINGULATION OF DIES FROM A WAFER

CHIP MANUFACTURING METHOD

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD

MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...

SEMICONDUCTOR DEVICE

METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER

STACKED DEVICES AND METHODS OF FABRICATION

Dielectric Walls for Complementary Field Effect Transistors

DEVICES INCLUDING STACKED NANOSHEET TRANSISTORS

Gate All-Around (GAA) Field Effect Transistors (FETS) Formed on Bot...

VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF

TRANSISTORS WITH DUAL POWER AND SIGNAL LINES

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...