the substrate being other than a semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/84the substrate being other than a semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
Fins for metal oxide semiconductor device structures
- Patent number 12,205,955
- Issue date Jan 21, 2025
- Intel Corporation
- Martin D. Giles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including decoupling capacitors
- Patent number 12,199,030
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Gate-all-around integrated circuit structures having removed substrate
- Patent number 12,199,143
- Issue date Jan 14, 2025
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for separating different transistor regions on...
- Patent number 12,199,102
- Issue date Jan 14, 2025
- Infineon Technologies Austria AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual strained semiconductor substrate and patterning
- Patent number 12,191,208
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar I/O and logic semiconductor devices having different wor...
- Patent number 12,191,207
- Issue date Jan 7, 2025
- Intel Corporation
- Roman W. Olac-Vaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF switch device with a sidewall spacer having a low dielectric con...
- Patent number 12,183,804
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics chips including a fully-depleted silicon-on-insulator fie...
- Patent number 12,176,351
- Issue date Dec 24, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,176,350
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked nanosheet gate-all-around device structures
- Patent number 12,166,042
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal gate stacks
- Patent number 12,166,105
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator semiconductor device with mixed doped regions
- Patent number 12,166,130
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jack Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,159,873
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit emulating neural system with neuron circuit and...
- Patent number 12,154,017
- Issue date Nov 26, 2024
- Seoul National University R&DBFoundation
- Byung-Gook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,154,962
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,154,957
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage three-dimensional devices having dielectric liners
- Patent number 12,136,628
- Issue date Nov 5, 2024
- Intel Corporation
- Walid M. Hafez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor having substantially parallelepiped-shaped insulatin...
- Patent number 12,125,899
- Issue date Oct 22, 2024
- STMicroelectronics (Rousset) SAS
- Arnaud Regnier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Isolation region fabrication for replacement gate processing
- Patent number RE50181
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Brent A. Anderson
Information Patent Grant
Method to form a fin structure on deep trenches for a semiconductor...
- Patent number 12,125,873
- Issue date Oct 22, 2024
- HeFeChip Corporation Limited
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device and electronic device
- Patent number 12,119,355
- Issue date Oct 15, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Atsushi Umezaki
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Symmetric FET for RF nonlinearity improvement
- Patent number 12,113,057
- Issue date Oct 8, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS
- Publication number 20250031446
- Publication date Jan 23, 2025
- Intel Corporation
- Walid M. HAFEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...
- Publication number 20250022882
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Martin W. Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
S-Contact for SOI
- Publication number 20250015082
- Publication date Jan 9, 2025
- pSemi Corporation
- Befruz Tasbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...
- Publication number 20250006740
- Publication date Jan 2, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006741
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHO...
- Publication number 20250006742
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPENING IN STRESS-INDUCING LINER(S) BETWEEN TRANSISTORS
- Publication number 20250006842
- Publication date Jan 2, 2025
- GLOBALFOUNDRIES U.S. Inc.
- George Robert Mulfinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...
- Publication number 20240429104
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Kevin J. Torek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SOI DEVICE FROM BULK SILICON SUBSTRATE AND SOI DEVICE
- Publication number 20240420993
- Publication date Dec 19, 2024
- Hangzhou HFC Semiconductor Co.
- Youming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY
- Publication number 20240420990
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVE DEVICE WITH THINNER Si LAYER
- Publication number 20240413164
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Switching Device
- Publication number 20240413243
- Publication date Dec 12, 2024
- MURATA MANUFACTURING CO., LTD.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES
- Publication number 20240405105
- Publication date Dec 5, 2024
- Analog Devices, Inc.
- F. Jacob Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS O...
- Publication number 20240395824
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...
- Publication number 20240395822
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240395602
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Soon-Kang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAPAROUND GATE STRUCTURE
- Publication number 20240395932
- Publication date Nov 28, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John L. LEMON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387665
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20240387187
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE
- Publication number 20240387738
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR STRUCTURE
- Publication number 20240379874
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Ching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION
- Publication number 20240379410
- Publication date Nov 14, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS

the substrate being other than a semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fins for metal oxide semiconductor device structures

Radio-frequency switching devices having improved voltage handling...

3D semiconductor devices and structures with metal layers

Semiconductor devices including decoupling capacitors

Gate-all-around integrated circuit structures having removed substrate

Isolation structure for separating different transistor regions on...

Dual strained semiconductor substrate and patterning

Non-planar I/O and logic semiconductor devices having different wor...

Method and apparatus for flexible circuit cable attachment

RF switch device with a sidewall spacer having a low dielectric con...

Photonics chips including a fully-depleted silicon-on-insulator fie...

Semiconductor structure and manufacturing method thereof

Semiconductor on insulator having a semiconductor layer with differ...

Stacked nanosheet gate-all-around device structures

Semiconductor device structure with metal gate stacks

Silicon on insulator semiconductor device with mixed doped regions

Semiconductor structure and manufacturing method thereof

Integrated circuit emulating neural system with neuron circuit and...

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of manufacture

Methods for producing a 3D semiconductor memory device and structure

3D semiconductor device and structure with single-crystal layers

High voltage three-dimensional devices having dielectric liners

Backside electrical contacts to buried power rails

MOS transistor having substantially parallelepiped-shaped insulatin...

3D semiconductor device and structure with metal layers and memory...

Isolation region fabrication for replacement gate processing

Method to form a fin structure on deep trenches for a semiconductor...

Liquid crystal display device and electronic device

Symmetric FET for RF nonlinearity improvement

Patents Applicationslast 30 patents

HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS

TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...

S-Contact for SOI

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHO...

OPENING IN STRESS-INDUCING LINER(S) BETWEEN TRANSISTORS

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

METHOD OF MAKING SOI DEVICE FROM BULK SILICON SUBSTRATE AND SOI DEVICE

SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

PASSIVE DEVICE WITH THINNER Si LAYER

High Voltage Switching Device

HIGH FREQUENCY HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

WRAPAROUND GATE STRUCTURE

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

SEMICONDUCTOR STRUCTURE WITH ISOLATION FEATURE

HYBRID INTEGRATED CIRCUIT DIES

TRANSISTOR, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR STRUCTURE

METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION