the substrate being other than a semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/786the substrate being other than a semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
SOI substrate and related methods
- Patent number 11,948,880
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RF devices with enhanced performance including at...
- Patent number 11,923,238
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,658,071
- Issue date May 23, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Saka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 11,495,529
- Issue date Nov 8, 2022
- Semiconductor Components Industries, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator (SOI) substrate and related methods
- Patent number 11,222,840
- Issue date Jan 11, 2022
- Semiconductor Components Industries, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 10,741,487
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a contact structure contacting a layer
- Patent number 10,741,494
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Aurore Constant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting device
- Patent number 10,672,945
- Issue date Jun 2, 2020
- Nichia Corporation
- Hirofumi Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting method of workpiece
- Patent number 10,658,218
- Issue date May 19, 2020
- Disco Corporation
- Makoto Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,643,880
- Issue date May 5, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for testing a semiconductor device and...
- Patent number 10,424,645
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Alexander Philippou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dividing wafer into individual chips
- Patent number 10,297,501
- Issue date May 21, 2019
- Disco Corporation
- Masamitsu Agari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transferring method, manufacturing method, device and electronic ap...
- Patent number 10,181,546
- Issue date Jan 15, 2019
- GoerTek Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broken line repair method of TFT substrate
- Patent number 10,101,601
- Issue date Oct 16, 2018
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- He Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,083,888
- Issue date Sep 25, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having recessed edges and method of manufacture
- Patent number 10,032,746
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost hermetic micro-electronics
- Patent number 9,721,864
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming package-on-package structures
- Patent number 9,666,572
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor element
- Patent number 9,653,644
- Issue date May 16, 2017
- Nichia Corporation
- Hiroaki Tamemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method using pulsed laser beam to form shield tunn...
- Patent number 9,536,786
- Issue date Jan 3, 2017
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,484,324
- Issue date Nov 1, 2016
- Rohm Co., Ltd.
- Toshio Nakasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having recessed edges and method of manufacture
- Patent number 9,443,780
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming package-on-package structures
- Patent number 9,373,610
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing image pickup apparatus and method for producin...
- Patent number 9,240,398
- Issue date Jan 19, 2016
- Olympus Corporation
- Noriyuki Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line placement to improve die sawing quality
- Patent number 8,993,355
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,823,155
- Issue date Sep 2, 2014
- Rohm Co., Ltd.
- Toshio Nakasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line placement to improve die sawing quality
- Patent number 8,519,512
- Issue date Aug 27, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20240266221
- Publication date Aug 8, 2024
- Disco Corporation
- Jinyan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE...
- Publication number 20240222213
- Publication date Jul 4, 2024
- NVIDIA Corporation
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20240203864
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES
- Publication number 20230386888
- Publication date Nov 30, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING THIN SUBSTRATES
- Publication number 20230115122
- Publication date Apr 13, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20230025410
- Publication date Jan 26, 2023
- Semiconductor Components Industries, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING NITRIDE MESAS EACH INTENDED TO FORM AN ELECTRO...
- Publication number 20220359479
- Publication date Nov 10, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Guy FEUILLET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXING SEMICONDUCTOR STRUCTURES AND RELATED TECHNIQUES
- Publication number 20220270925
- Publication date Aug 25, 2022
- Massachusetts Institute of Technology
- Vladimir BULOVIC
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20210183693
- Publication date Jun 17, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20200350243
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20200350242
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20200294857
- Publication date Sep 17, 2020
- Sony Semiconductor Solutions Corporation
- NAOKI SAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200194327
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Including a Contact Structure Contacting a Layer
- Publication number 20200144194
- Publication date May 7, 2020
- Semiconductor Components Industries, LLC
- Aurore CONSTANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20190326211
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICRO DEVICE
- Publication number 20190252232
- Publication date Aug 15, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING METHOD OF WORKPIECE
- Publication number 20190229005
- Publication date Jul 25, 2019
- Disco Corporation
- Makoto TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358276
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROKEN LINE REPAIR METHOD OF TFT SUBSTRATE
- Publication number 20180088365
- Publication date Mar 29, 2018
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- He Zhao
- G02 - OPTICS
Information Patent Application
TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...
- Publication number 20180069149
- Publication date Mar 8, 2018
- GOERTEK INC
- Quanbo ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HERMETIC MICRO-ELECTRONICS
- Publication number 20170194225
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Package-on-Package Structures
- Publication number 20150348957
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140335659
- Publication date Nov 13, 2014
- Toshio NAKASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Line Placement to Improve Die Sawing Quality
- Publication number 20130316471
- Publication date Nov 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Package-on-Package Structures
- Publication number 20130093078
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120091555
- Publication date Apr 19, 2012
- Rohm Co., Ltd.
- Toshio NAKASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ic Chip and Its Manufacturing Method
- Publication number 20080265376
- Publication date Oct 30, 2008
- Takuya Tsurume
- B32 - LAYERED PRODUCTS
Information Patent Application
Test line placement to improve die sawing quality
- Publication number 20080073753
- Publication date Mar 27, 2008
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

the substrate being other than a semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SOI substrate and related methods

Method of forming RF devices with enhanced performance including at...

Semiconductor device, method of manufacturing semiconductor device,...

SOI substrate and related methods

Semiconductor device and method of forming embedded wafer level chi...

Silicon-on-insulator (SOI) substrate and related methods

Method for transferring micro device

Semiconductor device and method of forming embedded wafer level chi...

SOI substrate and related methods

Electronic device including a contact structure contacting a layer

Method for manufacturing light emitting device

Cutting method of workpiece

Method for transferring micro device

Semiconductor device, method for testing a semiconductor device and...

Method for dividing wafer into individual chips

Transferring method, manufacturing method, device and electronic ap...

Broken line repair method of TFT substrate

Semiconductor device package

Semiconductor device having recessed edges and method of manufacture

Low cost hermetic micro-electronics

Process for forming package-on-package structures

Method for manufacturing semiconductor element

Wafer processing method using pulsed laser beam to form shield tunn...

Method of manufacturing semiconductor device

Semiconductor device having recessed edges and method of manufacture

Process for forming package-on-package structures

Method for producing image pickup apparatus and method for producin...

Test line placement to improve die sawing quality

Semiconductor device and method of manufacturing the same

Test line placement to improve die sawing quality

Patents Applicationslast 30 patents

PROCESSING METHOD OF WORKPIECE

EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE...

SOI SUBSTRATE AND RELATED METHODS

METHODS FOR MAKING SEMICONDUCTOR DEVICES

METHOD OF BONDING THIN SUBSTRATES

SOI SUBSTRATE AND RELATED METHODS

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

METHOD FOR PRODUCING NITRIDE MESAS EACH INTENDED TO FORM AN ELECTRO...

FLEXING SEMICONDUCTOR STRUCTURES AND RELATED TECHNIQUES

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

SOI SUBSTRATE AND RELATED METHODS

SOI SUBSTRATE AND RELATED METHODS

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE PACKAGE

Electronic Device Including a Contact Structure Contacting a Layer

SOI SUBSTRATE AND RELATED METHODS

METHOD FOR TRANSFERRING MICRO DEVICE

CUTTING METHOD OF WORKPIECE

SEMICONDUCTOR DEVICE PACKAGE

BROKEN LINE REPAIR METHOD OF TFT SUBSTRATE

TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC AP...

LOW COST HERMETIC MICRO-ELECTRONICS

Process for Forming Package-on-Package Structures

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Test Line Placement to Improve Die Sawing Quality

Process for Forming Package-on-Package Structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Ic Chip and Its Manufacturing Method

Test line placement to improve die sawing quality