-
-
SUBSTRATE PROCESSING METHOD
-
Publication number 20250006462
-
Publication date Jan 2, 2025
-
TOKYO ELECTRON LIMITED
-
Morihito INAGAKI
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
WAFER HOLDER ASSEMBLY
-
Publication number 20250006528
-
Publication date Jan 2, 2025
-
Taiwan Semiconductor Manufacturing company Ltd.
-
CHENG-YOU TAI
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
Reaction Chamber and Reaction Device
-
Publication number 20250003075
-
Publication date Jan 2, 2025
-
SHENZHEN NASO TECH CO., LTD.
-
Yunzhang Xiao
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
ROTATING SUBSTRATE SUPPORT
-
Publication number 20240420931
-
Publication date Dec 19, 2024
-
ASM IP HOLDING B.V.
-
Yukihiro Mori
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
COATING METHOD
-
Publication number 20240420914
-
Publication date Dec 19, 2024
-
Jiangsu Favored Nanotechnology Co., Ltd.
-
Jian ZONG
-
H01 - BASIC ELECTRIC ELEMENTS
-
METHOD AND APPARATUS FOR PRODUCING NITROGEN COMPOUND
-
Publication number 20240410077
-
Publication date Dec 12, 2024
-
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
-
Xuelun WANG
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
-
-
-
-
-
-
EPITAXIAL REACTION DEVICE
-
Publication number 20240309550
-
Publication date Sep 19, 2024
-
Shenzhen Naso Tech Co Ltd
-
Yunzhang XIAO
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
SUBSTRATE PROCESSING APPARATUS
-
Publication number 20240295027
-
Publication date Sep 5, 2024
-
TOKYO ELECTRON LIMITED
-
Junnosuke TAGUCHI
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID
-
Publication number 20240247373
-
Publication date Jul 25, 2024
-
Applied Materials, Inc.
-
Muhannad Mustafa
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
-
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
-
Publication number 20240222097
-
Publication date Jul 4, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Yu-Hsiang CHENG
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
DEPOSITION APPARATUS AND PROCESSING METHOD
-
Publication number 20240209508
-
Publication date Jun 27, 2024
-
TOKYO ELECTRON LIMITED
-
MANABU HONMA
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
FILM FORMING APPARATUS
-
Publication number 20240209507
-
Publication date Jun 27, 2024
-
TOKYO ELECTRON LIMITED
-
Manabu HONMA
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
SUBSTRATE PROCESSING APPARATUS
-
Publication number 20240209509
-
Publication date Jun 27, 2024
-
TOKYO ELECTRON LIMITED
-
Naoya FUKUDA
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...