TREA

the substrate having spherical bumps for external connection

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Industry

  • CPC
  • H01L23/3128
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3128the substrate having spherical bumps for external connection
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