the substrate having spherical bumps for external connection

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H01L23/3128

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/3128the substrate having spherical bumps for external connection

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
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- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
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- Issue date Apr 22, 2025
- Apple Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,556
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
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- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
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- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
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- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
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- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
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Information Patent Grant
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Information Patent Grant
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- Issue date Apr 15, 2025
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Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
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- Issue date Apr 8, 2025
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Information Patent Grant
Stacking structure, package structure and method of fabricating the...
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Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
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- Issue date Apr 8, 2025
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Information Patent Grant
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- Issue date Apr 8, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package including a multi-contact interconnect
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- Issue date Apr 1, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,266,648
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
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Information Patent Grant
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Information Patent Grant
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- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- Issue date Mar 25, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication date Apr 24, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250132261
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SEMICONDUCTOR PACKAGE
- Publication number 20250132243
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SEMICONDUCTOR PACKAGE
- Publication number 20250132218
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- Samsung Electronics Co., Ltd.
- KYUNG DON MUN
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132241
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- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
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Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132294
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- Publication number 20250132291
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- STATS ChipPAC Pte Ltd.
- DanFeng Yang
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SEMICONDUCTOR PACKAGE
- Publication number 20250133656
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Sang Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250125209
- Publication date Apr 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
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INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Publication number 20250125244
- Publication date Apr 17, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
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PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20250125249
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
- Publication number 20250125216
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- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
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- H01 - BASIC ELECTRIC ELEMENTS
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PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME
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OPTICAL MODULE USING OPTICAL SYSTEM-IN-PACKAGE, AND OPTICAL TRANSCE...
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- Seong Wook CHOI
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LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
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- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118702
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Kwang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
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- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
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- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118616
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Tea-Geon Kim
- H01 - BASIC ELECTRIC ELEMENTS
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CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE
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- Youngwoong Cho
- H01 - BASIC ELECTRIC ELEMENTS
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DENSELY PACKED ELECTRONIC SYSTEMS
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- Publication date Apr 10, 2025
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- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
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- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250118707
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS

the substrate having spherical bumps for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Package structure and method of manufacturing the same

High density interconnection using fanout interposer chiplet

Package structure

Package structure

Optoelectronic device package and method of manufacturing the same

Electronic package and method of forming the same

Semiconductor die with warpage release layer structure in package a...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor package

Logic drive based on multichip package comprising standard commodit...

Integrated fan-out package with 3D magnetic core inductor

Heterogeneous nested interposer package for IC chips

Stacking structure, package structure and method of fabricating the...

Semiconductor device package with conductive pillars and reinforcin...

Semiconductor devices and methods of manufacturing semiconductor de...

Heat-dissipating structures for semiconductor devices and methods o...

Integrated devices in semiconductor packages and methods of forming...

Stacked die package including a multi-contact interconnect

Package structure

Capacitor-wire-embedded wiring board

Semiconductor packages and manufacturing methods thereof

Chip package, electronic device, and chip package preparation method

Polymer material in a redistribution structure of a semiconductor p...

Semiconductor die with solder restraining wall

Semiconductor package

Semiconductor packages including antenna pattern

Semiconductor package

Info structure with copper pillar having reversed profile

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Flexible Encapsulant Ove...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

SEMICONDUCTOR PACKAGE

Semiconductor Package And Method Of Fabricating The Same

SEMICONDUCTOR PACKAGE STRUCTURE

INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING

PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...

PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME

OPTICAL MODULE USING OPTICAL SYSTEM-IN-PACKAGE, AND OPTICAL TRANSCE...

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Packages and Methods of Forming

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE

DENSELY PACKED ELECTRONIC SYSTEMS

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE