the support being a lead frame

Industry

CPC
H01L2225/1029

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1029the support being a lead frame

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,107,761
- Issue date Aug 31, 2021
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure
- Patent number 10,991,681
- Issue date Apr 27, 2021
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using leadframe bodies to form o...
- Patent number 10,903,183
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip monolithically integrated wit...
- Patent number 10,763,246
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-packaging for single-socketing
- Patent number 10,734,358
- Issue date Aug 4, 2020
- Intel Corporation
- Jonathan L. Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,643,918
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Toru Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional package structure
- Patent number 10,593,656
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,237,977
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 10,231,334
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for multi-die packaging
- Patent number 10,211,184
- Issue date Feb 19, 2019
- NXP USA, INC.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out wafer level package type semiconductor package and package...
- Patent number 10,153,219
- Issue date Dec 11, 2018
- Samsung Electronics Co., Ltd.
- Hyung-jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of making the same
- Patent number 10,049,986
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,966,303
- Issue date May 8, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package design with wire leads for package-on-package pr...
- Patent number 9,960,104
- Issue date May 1, 2018
- Intel Corporation
- Zhiyong Simon Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 9,936,576
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked electronic device with defect-free solder connection
- Patent number 9,913,375
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
- Patent number 9,806,017
- Issue date Oct 31, 2017
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a grid array with a leadfr...
- Patent number 9,799,589
- Issue date Oct 24, 2017
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based system-in-packages having sidewall-mounted surface...
- Patent number 9,761,569
- Issue date Sep 12, 2017
- NSP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including multiple semiconductor chips and multiple carriers
- Patent number 9,735,078
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level flipped die stacks with leadframes or metal foil interc...
- Patent number 9,666,513
- Issue date May 30, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,659,812
- Issue date May 23, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a 3D electronic module comprising externa...
- Patent number 9,659,846
- Issue date May 23, 2017
- 3D Plus
- Alexandre Val
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-PACKAGING FOR SINGLE-SOCKETING
- Publication number 20190385979
- Publication date Dec 19, 2019
- Intel Corporation
- Jonathan L. Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-tier conductive circuits free of supporting substrate with in...
- Publication number 20180343749
- Publication date Nov 29, 2018
- Bo Gosta Nystedt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180168038
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20180153035
- Publication date May 31, 2018
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT WAFER LEVEL PACKAGE TYPE SEMICONDUCTOR PACKAGE AND PACKAGE...
- Publication number 20180076103
- Publication date Mar 15, 2018
- Hyung-jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
- Publication number 20180025967
- Publication date Jan 25, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip Monolithically Integrated wit...
- Publication number 20170317001
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FLIPPED DIE STACKS WITH LEADFRAMES OR METAL FOIL INTERC...
- Publication number 20170077016
- Publication date Mar 16, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION
- Publication number 20170013714
- Publication date Jan 12, 2017
- International Business Machines Corporation
- Ai Kiar Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Multiple Semiconductor Chips and Multiple Carriers
- Publication number 20150303128
- Publication date Oct 22, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...
- Publication number 20150171061
- Publication date Jun 18, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20150123252
- Publication date May 7, 2015
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKED PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150115425
- Publication date Apr 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20150102508
- Publication date Apr 16, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Leadframe Bodies to Form O...
- Publication number 20140361423
- Publication date Dec 11, 2014
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140203291
- Publication date Jul 24, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS
- Publication number 20140167262
- Publication date Jun 19, 2014
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGES USING LASER DIRECT STRUCTURING
- Publication number 20140110162
- Publication date Apr 24, 2014
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140077347
- Publication date Mar 20, 2014
- SPANSION LLC
- Kouichi MEGHRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20140015130
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING IMPROVEMENTS
- Publication number 20130344682
- Publication date Dec 26, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

the support being a lead frame

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Semiconductor device

Three-dimensional package structure

Semiconductor device and method of using leadframe bodies to form o...

Device including a semiconductor chip monolithically integrated wit...

Package-on-package assembly with wire bond vias

Multi-packaging for single-socketing

Semiconductor device

Three-dimensional package structure

Microelectronic elements with post-assembly planarization

Microelectronic die packages with metal leads, including metal lead...

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Apparatus and methods for multi-die packaging

Fan out wafer level package type semiconductor package and package...

Microelectronic die packages with metal leads, including metal lead...

Package structures and methods of making the same

Microelectronic elements with post-assembly planarization

Integrated package design with wire leads for package-on-package pr...

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Integrated circuit packaging system with a grid array with a leadfr...

Leadframe-based system-in-packages having sidewall-mounted surface...

Package-on-package assembly with wire bond vias

Device including multiple semiconductor chips and multiple carriers

Wafer-level flipped die stacks with leadframes or metal foil interc...

Microelectronic elements with post-assembly planarization

Process for manufacturing a 3D electronic module comprising externa...

Patents Applicationslast 30 patents

MULTI-PACKAGING FOR SINGLE-SOCKETING

Multi-tier conductive circuits free of supporting substrate with in...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

FAN OUT WAFER LEVEL PACKAGE TYPE SEMICONDUCTOR PACKAGE AND PACKAGE...

FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Device Including a Semiconductor Chip Monolithically Integrated wit...

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

WAFER-LEVEL FLIPPED DIE STACKS WITH LEADFRAMES OR METAL FOIL INTERC...

MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

Device Including Multiple Semiconductor Chips and Multiple Carriers

STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...

LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP STACKED PACKAGE AND METHOD FOR FORMING THE SAME

STACKED PACKAGING IMPROVEMENTS

Semiconductor Device and Method of Using Leadframe Bodies to Form O...

Integrated Circuit Package System with Removable Backing Element Ha...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS

PACKAGED MICROELECTRONIC COMPONENTS

STACKED PACKAGES USING LASER DIRECT STRUCTURING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

STACKED PACKAGING IMPROVEMENTS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS