the under bump metallisation [UBM] being used as a mask for patterning other parts

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CPC
H01L2224/11914

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11914the under bump metallisation [UBM] being used as a mask for patterning other parts

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component that includes a protective structure
- Patent number 9,263,390
- Issue date Feb 16, 2016
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 9,219,010
- Issue date Dec 22, 2015
- Semiconductor Componenets Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 9,159,684
- Issue date Oct 13, 2015
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 8,692,367
- Issue date Apr 8, 2014
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component
- Patent number 8,445,375
- Issue date May 21, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 8,278,748
- Issue date Oct 2, 2012
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming multi-chip semiconductor substrates
- Patent number 7,871,857
- Issue date Jan 18, 2011
- Integrated Device Technology, Inc.
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a bump on a substrate using multiple photoresist l...
- Patent number 6,586,322
- Issue date Jul 1, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262953
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262846
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO PREVENT SOLDER EXTRUSION
- Publication number 20150108642
- Publication date Apr 23, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES
- Publication number 20140319522
- Publication date Oct 30, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20130244418
- Publication date Sep 19, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component that includes a protective structure
- Publication number 20130234311
- Publication date Sep 12, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS
- Publication number 20110198745
- Publication date Aug 18, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
- Publication number 20110074034
- Publication date Mar 31, 2011
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A BUMP ON A SUBSTRATE USING MULTIPLE PHOTORESIST L...
- Publication number 20030119300
- Publication date Jun 26, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

the under bump metallisation [UBM] being used as a mask for patterning other parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor component that includes a protective structure

Method of manufacturing a semiconductor component

Wafer-level packaged device having self-assembled resilient leads

Wafer-level packaged device having self-assembled resilient leads

Method for manufacturing a semiconductor component

Wafer-level packaged device having self-assembled resilient leads

Methods of forming multi-chip semiconductor substrates

Method of making a bump on a substrate using multiple photoresist l...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD

STRUCTURE TO PREVENT SOLDER EXTRUSION

FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

Semiconductor component that includes a protective structure

WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

METHOD OF MAKING A BUMP ON A SUBSTRATE USING MULTIPLE PHOTORESIST L...