the whole bonding area protruding from the surface of the body

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H01L2224/08113

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08113the whole bonding area protruding from the surface of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,021,042
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack packaging structure and chip stack packaging method
- Patent number 11,869,872
- Issue date Jan 9, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 11,264,369
- Issue date Mar 1, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 11,264,342
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 10,636,778
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Barry Jon Male
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 10,559,546
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 10,177,104
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator integrated circuits with package structure cavity and fabr...
- Patent number 10,074,639
- Issue date Sep 11, 2018
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate with buried substrate having linear conductors
- Patent number 9,960,120
- Issue date May 1, 2018
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure for three-dimensional semiconductor device
- Patent number 9,698,080
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure of a semiconductor device, method of manufacturing th...
- Patent number 9,570,411
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Nam-Gyu Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for carrying out a conductive direct metal bonding
- Patent number 9,472,530
- Issue date Oct 18, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package structure and methods of forming
- Patent number 9,472,516
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable apparatus, IC packaging structure, IC packaging object, an...
- Patent number 9,443,809
- Issue date Sep 13, 2016
- UPI Semiconductor Corporation
- Chau-Chun Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 8,134,235
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240312930
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON MODE SUPPRESSION CIRCUIT
- Publication number 20240274530
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE...
- Publication number 20240222213
- Publication date Jul 4, 2024
- NVIDIA Corporation
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194553
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178192
- Publication date May 30, 2024
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153919
- Publication date May 9, 2024
- Samsung Electronics Co., LTD
- Hyeonjeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096717
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- AE-NEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240071995
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Raeyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014087
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- In Sup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369178
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230935
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230207490
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Yung Sheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD
- Publication number 20230178514
- Publication date Jun 8, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230005813
- Publication date Jan 5, 2023
- Sony Semiconductor Solutions Corporation
- YOICHIRO FUJINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...
- Publication number 20200258874
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200152587
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190131261
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...
- Publication number 20190006338
- Publication date Jan 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon Male
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

the whole bonding area protruding from the surface of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Chip stack packaging structure and chip stack packaging method

Chip structure and method for forming the same

Isolator integrated circuits with package structure cavity and fabr...

Package on package structure and method for forming the same

Isolator integrated circuits with package structure cavity and fabr...

Package on package structure and method for forming the same

Package on package structure and method for forming the same

Isolator integrated circuits with package structure cavity and fabr...

Wiring substrate with buried substrate having linear conductors

Conductor structure for three-dimensional semiconductor device

Pad structure of a semiconductor device, method of manufacturing th...

Method for carrying out a conductive direct metal bonding

Fan out package structure and methods of forming

Portable apparatus, IC packaging structure, IC packaging object, an...

Three-dimensional semiconductor device

Patents Applicationslast 30 patents

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

Power Semiconductor Devices Including Beryllium Metallization

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

COMMON MODE SUPPRESSION CIRCUIT

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE...

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

CHIP STRUCTURE

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGE

CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD

SEMICONDUCTOR APPARATUS

ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...

PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABR...