the whole layer connector protruding from the surface

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H01L2224/32113

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32113the whole layer connector protruding from the surface

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,790,235
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 10,535,546
- Issue date Jan 14, 2020
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,220
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Yoko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 9,780,523
- Issue date Oct 3, 2017
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an anti-pad peeling structure and associa...
- Patent number 9,711,478
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,508,685
- Issue date Nov 29, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,449,937
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element and a fixed...
- Patent number 9,437,520
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune Orimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 9,263,335
- Issue date Feb 16, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic solder structure for chip
- Patent number 9,214,443
- Issue date Dec 15, 2015
- Lextar Electronics Corporation
- Yi-Jyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 8,981,566
- Issue date Mar 17, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307346
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
- Publication number 20230163043
- Publication date May 25, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING ALIGN MARK PROTECTION PATTERN AND SEMI...
- Publication number 20230154860
- Publication date May 18, 2023
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ANTI-PAD PEELING STRUCTURE AND ASSOCIA...
- Publication number 20170110429
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KAI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20160035702
- Publication date Feb 4, 2016
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380374
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150155251
- Publication date Jun 4, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EUTECTIC SOLDER STRUCTURE FOR CHIP
- Publication number 20150108650
- Publication date Apr 23, 2015
- Lextar Electronics Corporation
- Yi-Jyun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20130320551
- Publication date Dec 5, 2013
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
- Publication number 20120175755
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

the whole layer connector protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a semiconductor arrangement

Micro device arrangement in donor substrate

Semiconductor arrangement and method for producing the same

Integrated fan-out package and method of fabricating the same

Micro device arrangement in donor substrate

Integrated fan-out package and method of fabricating the same

Micro device arrangement in donor substrate

Structure and formation method of chip package structure

Semiconductor device

Vertically integrated wafers with thermal dissipation

Semiconductor laser device

Semiconductor device with an anti-pad peeling structure and associa...

Vertically integrated wafers with thermal dissipation

Semiconductor device and method for manufacturing the same

Semiconductor device including a semiconductor element and a fixed...

Discrete semiconductor device package and manufacturing method

Eutectic solder structure for chip

Discrete semiconductor device package and manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...

SEMICONDUCTOR CHIP INCLUDING ALIGN MARK PROTECTION PATTERN AND SEMI...

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH AN ANTI-PAD PEELING STRUCTURE AND ASSOCIA...

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

SEMICONDUCTOR DEVICE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

EUTECTIC SOLDER STRUCTURE FOR CHIP

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER