the wire connector connecting to a bonding area disposed in a recess of the surface

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CPC
H01L2224/48138

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48138the wire connector connecting to a bonding area disposed in a recess of the surface

Industries

Patents Grantslast 30 patents

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Information Patent Grant
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Information Patent Grant
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Method of making a wire support leadframe for a semiconductor device
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Information Patent Grant
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Information Patent Grant
Wire support for a leadframe
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Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
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Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
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Information Patent Grant
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Information Patent Application
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RADIOFREQUENCY TRANSMISSION/RECEPTION DEVICE
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Method Of Making A Wire Support Leadframe For A Semiconductor Device
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Wire Support For A Leadframe
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Method Of Making A Wire Support Leadframe For A Semiconductor Device
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
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Information Patent Application
Wire Support for a Leadframe
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BONDING PAD ARRANGMENT DESIGN FOR MULTI-DIE SEMICONDUCTOR PACKAGE S...
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- H01 - BASIC ELECTRIC ELEMENTS

the wire connector connecting to a bonding area disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC package with heat spreader

Semiconductor device packages with high angle wire bonding and non-...

Radiofrequency transmission/reception device

Semiconductor package

Method of making a wire support leadframe for a semiconductor device

Bonding wire having a silver alloy core, wire bonding method using...

Wire support for a leadframe

Method of manufacturing semiconductor device and semiconductor device

Method of making a wire support leadframe for a semiconductor device

Wire support for a leadframe

Method of manufacturing semiconductor device and semiconductor device

Bonding pad arrangment design for multi-die semiconductor package s...

Contact arrangements for stackable microelectronic package structur...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE ARRANGEMENTS

INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...

IC PACKAGE WITH HEAT SPREADER

POWER CONVERTER APPARATUS

INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR

IC PACKAGE WITH HEAT SPREADER

RADIO FREQUENCY CHIP PACKAGE

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

SEMICONDUCTOR PACKAGE

RADIOFREQUENCY TRANSMISSION/RECEPTION DEVICE

Method Of Making A Wire Support Leadframe For A Semiconductor Device

Wire Support For A Leadframe

Method Of Making A Wire Support Leadframe For A Semiconductor Device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Wire Support for a Leadframe

BONDING PAD ARRANGMENT DESIGN FOR MULTI-DIE SEMICONDUCTOR PACKAGE S...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE