the wire connector extending above another semiconductor or solid-state body

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H01L2224/48111

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48111the wire connector extending above another semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,901,328
- Issue date Feb 13, 2024
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,309,276
- Issue date Apr 19, 2022
- Fuji Electric Co., Ltd.
- Yuma Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising an electric component
- Patent number 11,177,628
- Issue date Nov 16, 2021
- OSRAM OLED GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad and bond wire or clip
- Patent number 10,971,435
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 10,796,931
- Issue date Oct 6, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising an electric component
- Patent number 10,637,206
- Issue date Apr 28, 2020
- OSRAM OLED GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit modules and smart cards incorporating the same
- Patent number 10,565,487
- Issue date Feb 18, 2020
- SMARTFLEX TECHNOLOGY PTE LTD
- Eng Seng Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting diode package
- Patent number 10,355,184
- Issue date Jul 16, 2019
- SEOUL VIOSYS CO., LTD.
- Jun Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module with capacitor and digital coherent receiver using t...
- Patent number 10,072,977
- Issue date Sep 11, 2018
- NEC Corporation
- Taro Kaneko
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor module
- Patent number 9,941,255
- Issue date Apr 10, 2018
- Mitsubishi Electric Corporation
- Junichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,899,328
- Issue date Feb 20, 2018
- Mitsubishi Electric Corporation
- Yoshiko Tamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,786,587
- Issue date Oct 10, 2017
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 9,780,731
- Issue date Oct 3, 2017
- NXP USA, INC.
- Youri Volokhine
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package
- Patent number 9,780,049
- Issue date Oct 3, 2017
- Samsung Electronics Co., Ltd.
- Jin-chan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device including a multilevel carrier
- Patent number 9,754,862
- Issue date Sep 5, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Light-emitting part and light-emitting apparatus, and production me...
- Patent number 9,583,468
- Issue date Feb 28, 2017
- Toyoda Gosei Co., Ltd.
- Yuya Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package having the same
- Patent number 9,543,251
- Issue date Jan 10, 2017
- SK hynix Inc.
- Tae Min Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,530,721
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Atsushi Nishikizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,490,200
- Issue date Nov 8, 2016
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND IGNITION DEVICE
- Publication number 20240153852
- Publication date May 9, 2024
- ROHM CO., LTD.
- Yoshiaki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
- Publication number 20240038295
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Um
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...
- Publication number 20240006369
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20220244111
- Publication date Aug 4, 2022
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- G02 - OPTICS
Information Patent Application
MODULE
- Publication number 20220199568
- Publication date Jun 23, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210288020
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210280555
- Publication date Sep 9, 2021
- Fuji Electric Co., Ltd.
- Yuma MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING AN ELECTRIC COMPONENT
- Publication number 20200328572
- Publication date Oct 15, 2020
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20200126815
- Publication date Apr 23, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190013214
- Publication date Jan 10, 2019
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE
- Publication number 20180261739
- Publication date Sep 13, 2018
- Seoul Viosys Co., Ltd.
- Jun Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20170263568
- Publication date Sep 14, 2017
- Amkor Technology, Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVE EQUALIZER CIRCUIT
- Publication number 20170069582
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- Il-Joon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20160351505
- Publication date Dec 1, 2016
- Mitsubishi Electric Corporation
- Yoshiko TAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140339704
- Publication date Nov 20, 2014
- Jin-chan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140312498
- Publication date Oct 23, 2014
- RENESAS ELECTRONICS CORPORATION
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Constructing an Isolation Capacitor in an...
- Publication number 20140252551
- Publication date Sep 11, 2014
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated High Voltage Isolation Using Low Value Capacitors
- Publication number 20140253227
- Publication date Sep 11, 2014
- Randy Yach
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DUAL-FLAG STACKED DIE PACKAGE
- Publication number 20140239472
- Publication date Aug 28, 2014
- Frank Tim Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER AND SEMICONDUCTOR MODULE
- Publication number 20140138075
- Publication date May 22, 2014
- Industrial Technology Research Institute
- Shu-Jung Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20140061881
- Publication date Mar 6, 2014
- Realtek Semiconductor Corp.
- Ta-Hsun Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGES, SYSTEM IN PACKAGES INCLUDING THE SAME, AND MET...
- Publication number 20140015147
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Moon Soo KIM
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20130175681
- Publication date Jul 11, 2013
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120256194
- Publication date Oct 11, 2012
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER CIRCUIT
- Publication number 20120062325
- Publication date Mar 15, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Joong KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR LASER DEVICE AND DISPLAY
- Publication number 20100290498
- Publication date Nov 18, 2010
- SANYO ELECTRIC CO., LTD.
- Masayuki Hata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20100270906
- Publication date Oct 28, 2010
- Masami NISHI
- H01 - BASIC ELECTRIC ELEMENTS

the wire connector extending above another semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of manufacturing a semiconductor device having a bond wire o...

Semiconductor device having conductive wire with increased attachme...

Semiconductor module

Assembly comprising an electric component

Semiconductor device including bonding pad and bond wire or clip

Semiconductor device having conductive wire with increased attachme...

Manufacturing method of package structure

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Assembly comprising an electric component

Vibrator device, oscillator, electronic device, and vehicle

Integrated circuit modules and smart cards incorporating the same

Light-emitting diode package

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor device having conductive wire with increased attachme...

Optical module with capacitor and digital coherent receiver using t...

Power semiconductor module

Power semiconductor module

Semiconductor device and method for manufacturing the semiconductor...

High frequency amplifier

Semiconductor package

Compound semiconductor device including a multilevel carrier

Integrated circuit chip using top post-passivation technology and b...

Light-emitting part and light-emitting apparatus, and production me...

Semiconductor chip and semiconductor package having the same

Semiconductor device

Semiconductor module package and method of manufacturing the same

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND IGNITION DEVICE

SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD

MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

ASSEMBLY COMPRISING AN ELECTRIC COMPONENT

MANUFACTURING METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DIODE PACKAGE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICE INCLUDING PASSIVE EQUALIZER CIRCUIT

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Method and Apparatus for Constructing an Isolation Capacitor in an...

Integrated High Voltage Isolation Using Low Value Capacitors

DUAL-FLAG STACKED DIE PACKAGE

HEAT EXCHANGER AND SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT

CHIP STACK PACKAGES, SYSTEM IN PACKAGES INCLUDING THE SAME, AND MET...

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

POWER AMPLIFIER CIRCUIT

SEMICONDUCTOR LASER DEVICE AND DISPLAY

LIGHT EMITTING DEVICE