the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool

Industry

CPC
B24B37/102

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/102the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Polishing and loading/unloading component module
- Patent number 12,194,592
- Issue date Jan 14, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Grant
Metallographic grinder and components thereof
- Patent number 11,397,139
- Issue date Jul 26, 2022
- Leco Corporation
- John Hauck
- B24 - GRINDING POLISHING
Information Patent Grant
Offset head-spindle for chemical mechanical polishing
- Patent number 11,389,925
- Issue date Jul 19, 2022
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Rock polishing systems and methods
- Patent number 8,702,473
- Issue date Apr 22, 2014
- Gordon Lyons
- B24 - GRINDING POLISHING
Information Patent Grant
Equipment and method for polishing both sides of a rectangular subs...
- Patent number 7,214,124
- Issue date May 8, 2007
- Okamoto Machine Tool Works Ltd.
- Kazuo Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Reciprocal blade lapping machine
- Patent number 6,932,684
- Issue date Aug 23, 2005
- Roy H. Hunt
- B24 - GRINDING POLISHING
Information Patent Grant
Device for polishing digital storage discs
- Patent number 6,840,847
- Issue date Jan 11, 2005
- Peter Wolters Werkzeugmaschinen GmbH
- Rolf Vatterott
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for the restoration of optical storage media
- Patent number 6,261,159
- Issue date Jul 17, 2001
- Kevin Krieg
- B24 - GRINDING POLISHING
Information Patent Grant
Surface polishing machine
- Patent number 6,093,088
- Issue date Jul 25, 2000
- NEC Corporation
- Masashige Mitsuhashi
- B24 - GRINDING POLISHING
Information Patent Grant
Work planarizing method and apparatus
- Patent number 6,039,638
- Issue date Mar 21, 2000
- Speedfam Co., Ltd.
- Hitoshi Nagayama
- B24 - GRINDING POLISHING
Information Patent Grant
Sample holder for parallel lapping tool and method of using
- Patent number 6,007,409
- Issue date Dec 28, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee Chung
- B24 - GRINDING POLISHING
Information Patent Grant
Lapping method and system for compensating for substrate bow
- Patent number 5,967,878
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Christopher Arcona
- B24 - GRINDING POLISHING
Information Patent Grant
CMP wafer carrier for preferential polishing of a wafer
- Patent number 5,885,135
- Issue date Mar 23, 1999
- International Business Machines Corporation
- Daniel D. Desorcie
- B24 - GRINDING POLISHING
Information Patent Grant
Jig for polishing the edge of a thin solid state array panel
- Patent number 5,658,186
- Issue date Aug 19, 1997
- Sterling Diagnostic Imaging, Inc.
- Joseph A. Perrotto
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for realtime monitoring and feedback control o...
- Patent number 5,649,849
- Issue date Jul 22, 1997
- Eastman Kodak Company
- David Pileri
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor substrate
- Patent number 5,643,405
- Issue date Jul 1, 1997
- Motorola, Inc.
- Fernando A. Bello
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a wafer by supplying surfactant to the rear su...
- Patent number 5,616,212
- Issue date Apr 1, 1997
- NEC Corporation
- Akira Isobe
- B24 - GRINDING POLISHING
Information Patent Grant
Pulsed-force chemical mechanical polishing
- Patent number 5,562,530
- Issue date Oct 8, 1996
- Sematech, Inc.
- Scott Runnels
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing a workpiece
- Patent number 5,398,459
- Issue date Mar 21, 1995
- Kabushiki Kaisha Toshiba
- Katsuya Okumura
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus and method
- Patent number 5,377,451
- Issue date Jan 3, 1995
- MEMC Electronic Materials, Inc.
- Fabrizio Leoni
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improving planarity of chemical-mechanical...
- Patent number 5,232,875
- Issue date Aug 3, 1993
- Micron Technology, Inc.
- Mark E. Tuttle
- B24 - GRINDING POLISHING
Information Patent Grant
Automated free abrasive machine for one side piece part machining
- Patent number 5,224,304
- Issue date Jul 6, 1993
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method for lapping a wafer material and an apparatus therefor
- Patent number 4,918,869
- Issue date Apr 24, 1990
- Fujikoshi Machinery Corporation
- Satoru Kitta
- B24 - GRINDING POLISHING
Information Patent Grant
Floating subcarriers for wafer polishing apparatus
- Patent number 4,918,870
- Issue date Apr 24, 1990
- Siltec Corporation
- Walter Torbert
- B24 - GRINDING POLISHING
Information Patent Grant
Float lapping fixture
- Patent number 4,707,948
- Issue date Nov 24, 1987
- Unisys Corp.
- Abbott M. Schindler
- B24 - GRINDING POLISHING
Information Patent Grant
Precision lapping system
- Patent number 4,536,992
- Issue date Aug 27, 1985
- Magnetic Peripherals
- Douglas J. Hennenfent
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control for wafer polishing
- Patent number 4,450,652
- Issue date May 29, 1984
- Monsanto Company
- Robert J. Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for polishing a semiconductor wafer
- Patent number 4,373,991
- Issue date Feb 15, 1983
- Western Electric Company, Inc.
- Edward L. Banks
- B24 - GRINDING POLISHING
Information Patent Grant
Bearing mount for lapping machine pressure plate
- Patent number 4,270,314
- Issue date Jun 2, 1981
- Speedfam Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method for lapping semiconductor material
- Patent number 4,098,031
- Issue date Jul 4, 1978
- Bell Telephone Laboratories, Incorporated
- Robert Louis Hartman
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
- Publication number 20230128739
- Publication date Apr 27, 2023
- STMicroelectronics S.r.l.
- Agata GRASSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SE...
- Publication number 20220161388
- Publication date May 26, 2022
- SUMCO CORPORATION
- Yuki NAKANO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING AND LOADING/UNLOADING COMPONENT MODULE
- Publication number 20210205952
- Publication date Jul 8, 2021
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Application
Equipment and method for polishing both sides of a rectangular subs...
- Publication number 20070060027
- Publication date Mar 15, 2007
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Kazuo Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
Device for polishing digital storage discs
- Publication number 20040023605
- Publication date Feb 5, 2004
- Rolf Vatterott
- B24 - GRINDING POLISHING

the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polishing and loading/unloading component module

Metallographic grinder and components thereof

Offset head-spindle for chemical mechanical polishing

Rock polishing systems and methods

Equipment and method for polishing both sides of a rectangular subs...

Reciprocal blade lapping machine

Device for polishing digital storage discs

Apparatus and method for the restoration of optical storage media

Surface polishing machine

Work planarizing method and apparatus

Sample holder for parallel lapping tool and method of using

Lapping method and system for compensating for substrate bow

CMP wafer carrier for preferential polishing of a wafer

Jig for polishing the edge of a thin solid state array panel

Method and apparatus for realtime monitoring and feedback control o...

Method for polishing a semiconductor substrate

Method for polishing a wafer by supplying surfactant to the rear su...

Pulsed-force chemical mechanical polishing

Method and apparatus for polishing a workpiece

Wafer polishing apparatus and method

Method and apparatus for improving planarity of chemical-mechanical...

Automated free abrasive machine for one side piece part machining

Method for lapping a wafer material and an apparatus therefor

Floating subcarriers for wafer polishing apparatus

Float lapping fixture

Precision lapping system

Temperature control for wafer polishing

Methods and apparatus for polishing a semiconductor wafer

Bearing mount for lapping machine pressure plate

Method for lapping semiconductor material

Patents Applicationslast 30 patents

CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...

POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SE...

POLISHING AND LOADING/UNLOADING COMPONENT MODULE

Equipment and method for polishing both sides of a rectangular subs...

Device for polishing digital storage discs