Thermal cleaning

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H01L2224/83014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83014Thermal cleaning

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure on gold thin film
- Patent number 10,668,696
- Issue date Jun 2, 2020
- Fujikura Ltd.
- Shohei Kumeta
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D integrated heterostructures having low-temperature bonded interf...
- Patent number 9,117,686
- Issue date Aug 25, 2015
- Soitec
- Gweltaz Gaudin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-temperature bonding process
- Patent number 8,790,992
- Issue date Jul 29, 2014
- Soitec
- Gweltaz Gaudin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D INTEGRATED HETEROSTRUCTURES HAVING LOW-TEMPERATURE BONDED INTERF...
- Publication number 20140327113
- Publication date Nov 6, 2014
- Gweltaz Gaudin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-TEMPERATURE BONDING PROCESS
- Publication number 20120043647
- Publication date Feb 23, 2012
- Gweltaz M. Gaudin
- B81 - MICRO-STRUCTURAL TECHNOLOGY