Thermal cleaning

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CPC
H01L2224/81014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81014Thermal cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,922,027
- Issue date Dec 30, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,860,232
- Issue date Oct 14, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,846,450
- Issue date Sep 30, 2014
- Ziptronix, Inc.
- Qin-yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,524,533
- Issue date Sep 3, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,842,540
- Issue date Nov 30, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,602,070
- Issue date Oct 13, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for room temperature metal direct bonding
- Patent number 6,962,835
- Issue date Nov 8, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,410,881
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,269,998
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,161,748
- Issue date Dec 19, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 6,133,135
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing electronic circuits
- Patent number 5,940,728
- Issue date Aug 17, 1999
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20110041329
- Publication date Feb 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20070232023
- Publication date Oct 4, 2007
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Room temperature metal direct bonding
- Publication number 20050161795
- Publication date Jul 28, 2005
- Ziptronix
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Room temperature metal direct bonding
- Publication number 20040157407
- Publication date Aug 12, 2004
- Ziptronix
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for manufacturing electronic circuits
- Publication number 20010039725
- Publication date Nov 15, 2001
- Hitachi, Ltd.
- Kaoru Katayama
- H01 - BASIC ELECTRIC ELEMENTS

Thermal cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing semiconductor chip

Method for producing semiconductor package

Room temperature metal direct bonding

Method of manufacturing an electronic device, and electronic device...

Room temperature metal direct bonding

Bonding structure manufacturing method, heating and melting treatme...

Electronic device having electrodes bonded with each other

Electronic device having electrodes bonded with each other

Room temperature metal direct bonding

Bonding structure manufacturing method, heating and melting treatme...

Room temperature metal direct bonding

Room temperature metal direct bonding

Room temperature metal direct bonding

Method for room temperature metal direct bonding

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Process for manufacturing electronic circuits

Patents Applicationslast 30 patents

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

ROOM TEMPERATURE METAL DIRECT BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

Room temperature metal direct bonding

Room temperature metal direct bonding

Process for manufacturing electronic circuits