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H01L2224/85014
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85014
Thermal cleaning
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Patents Grants
last 30 patents
Information
Patent Grant
Methods and systems for laser assisted wirebonding
Patent number
7,476,597
Issue date
Jan 13, 2009
Texas Instruments Incorporated
Willmar E. Subido
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
Publication number
20090029542
Publication date
Jan 29, 2009
TEXAS INSTRUMENTS INCORPORATED
Willmar E. SUBIDO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods and Systems for Laser Assisted Wirebonding
Publication number
20080009129
Publication date
Jan 10, 2008
Willmar E. Subido
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Laser cleaning system for a wire bonding machine
Publication number
20050184133
Publication date
Aug 25, 2005
Kulicke & Soffa Investments, Inc.
Horst Clauberg
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR