Thermal cleaning

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H01L2224/80014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80014Thermal cleaning

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,048,283
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS