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CPC
H05K2201/06

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/06Thermal details

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual-sided expansion card with offset slot alignment
- Patent number 12,262,471
- Issue date Mar 25, 2025
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 12,238,866
- Issue date Feb 25, 2025
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery charger including an isolating member
- Patent number 12,212,169
- Issue date Jan 28, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. Silha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks for electronic circuits
- Patent number 12,200,852
- Issue date Jan 14, 2025
- Auradine Inc.
- Glen Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Technologies for dynamically managing resources in disaggregated ac...
- Patent number 12,191,987
- Issue date Jan 7, 2025
- Intel Corporation
- Francesc Guim Bernat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid ejecting head unit and liquid ejecting apparatus
- Patent number 12,179,484
- Issue date Dec 31, 2024
- Seiko Epson Corporation
- Ryota Kinoshita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 12,156,372
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded system module thermal installation verification
- Patent number 12,144,118
- Issue date Nov 12, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Craig K. Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite phase change material, application method of composite ph...
- Patent number 12,134,727
- Issue date Nov 5, 2024
- DONGGUAN NVT TECHNOLOGY LIMITED
- Hao Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD WITH STIFFENER
- Publication number 20250106984
- Publication date Mar 27, 2025
- KYOCCERA CORPORATION
- Suguru KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...
- Publication number 20250089152
- Publication date Mar 13, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Yaniv Kazav
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...
- Publication number 20250089153
- Publication date Mar 13, 2025
- Delta Electronics, Inc.
- Jui-Chien HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Module and Communication Device
- Publication number 20250081326
- Publication date Mar 6, 2025
- Huawei Technologies Co., Ltd
- Xiaodong Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES
- Publication number 20250081327
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Mandar Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250063667
- Publication date Feb 20, 2025
- ASUSTek COMPUTER INC.
- Chih-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...
- Publication number 20250063650
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Matthew David TURNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLED OPTICS ATTACHED TO A PRINTED CIRCUIT BOARD
- Publication number 20250056708
- Publication date Feb 13, 2025
- Nokia Solutions and Networks Oy
- Cristian Bolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...
- Publication number 20250048530
- Publication date Feb 6, 2025
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250048552
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20250048560
- Publication date Feb 6, 2025
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D-SHAPED MODULE WITH INTEGRATED DEVICES AND METHOD
- Publication number 20250040037
- Publication date Jan 30, 2025
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE
- Publication number 20250040025
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- KOICHI SHIGETA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20250040039
- Publication date Jan 30, 2025
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT IRRADIATING APPARATUS
- Publication number 20250026134
- Publication date Jan 23, 2025
- HOYA CORPORATION
- Norio KOBAYASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL INTERFACE ARRANGEMENT
- Publication number 20250024584
- Publication date Jan 16, 2025
- Genomtec S.A.
- Henryk Roguszczak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
- Publication number 20240431061
- Publication date Dec 26, 2024
- Intel Corporation
- Alonso Rodriguez Chacon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...
- Publication number 20240422892
- Publication date Dec 19, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240414835
- Publication date Dec 12, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE ADJUSTMENT MODULE AND TEMPERATURE ADJUSTMENT METHOD
- Publication number 20240414834
- Publication date Dec 12, 2024
- GIGA-BYTE TECHNOLOGY CO.,LTD.
- Chih-Hua Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual-sided expansion card with offset slot alignment

Heat sinks with beyond-board fins

Multi-layer line structure

Component carrier with embedded semiconductor component and embedde...

Heatsink techniques for optical and electrical modules

Motor controller heat dissipating systems and methods

Systems and methods providing high-density memory arrangements with...

Power semiconductor device and method for manufacturing power semic...

Electronic control device

Electronic device

Circuit board

Battery charger including an isolating member

Beveled overburden for vias and method of making the same

Heat sinks for electronic circuits

Ground discontinuities for thermal isolation

Technologies for dynamically managing resources in disaggregated ac...

Liquid ejecting head unit and liquid ejecting apparatus

High frequency and high power thin film component

Airflow in a card-based computing device

Wafer level bump stack for chip scale package

Heatsink based power delivery for CPUs

Localized immersion cooling enclosure with thermal efficiency features

Method and procedure for miniaturing a multi-layer PCB

Package assembly

Embedded system module thermal installation verification

Composite phase change material, application method of composite ph...

Hermetic metallized via with improved reliability

Thermosetting resin composition for semiconductor package, prepreg...

Flexible circuit board with thermally conductive connection to a he...

Maintaining the shape of a circuit board

Patents Applicationslast 30 patents

WIRING BOARD WITH STIFFENER

SEMICONDUCTOR MODULE

DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...

SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...

Circuit Board Module and Communication Device

NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...

COOLED OPTICS ATTACHED TO A PRINTED CIRCUIT BOARD

CONFINEMENT AND PROTECTION OF A THERMAL INTERFACE MATERIAL BETWEEN...

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

3D-SHAPED MODULE WITH INTEGRATED DEVICES AND METHOD

ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE

PACKAGE ASSEMBLY

LIGHT IRRADIATING APPARATUS

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

THERMAL INTERFACE ARRANGEMENT

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

WIRING BOARD

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS

Method of Producing a PCB, as well as a PCB, and a Circuit Board

HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

TEMPERATURE ADJUSTMENT MODULE AND TEMPERATURE ADJUSTMENT METHOD