Thermal details

Industry

CPC
H05K2201/06

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/06Thermal details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for dismantling of double-sided PCBA
- Patent number 12,336,110
- Issue date Jun 17, 2025
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management solution for power stage comprising top-cooled p...
- Patent number 12,336,148
- Issue date Jun 17, 2025
- GaN Systems Inc.
- Ruoyu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchange method using fluorinated compounds having a low GWP
- Patent number 12,325,819
- Issue date Jun 10, 2025
- Solvay Specialty Polymers Italy S.p.A.
- Emanuela Antenucci
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gravity independent liquid cooling for electronics
- Patent number 12,324,128
- Issue date Jun 3, 2025
- Worcester Polytechnic Institute
- Jamal S. Yagoobi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with slim control assembly
- Patent number 12,313,943
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Moonyoung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 12,309,912
- Issue date May 20, 2025
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) cooling
- Patent number 12,309,911
- Issue date May 20, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 12,309,925
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly comprising a circuit carrier and a heat sink
- Patent number 12,279,361
- Issue date Apr 15, 2025
- HELLA GMBH & CO. KGAA
- Christopher Peron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly, unit, and light module for a motor vehicle lighti...
- Patent number 12,267,944
- Issue date Apr 1, 2025
- HELLA GMBH & CO. KGAA
- Sebastian Bartscher
- F21 - LIGHTING
Information Patent Grant
Dual-sided expansion card with offset slot alignment
- Patent number 12,262,471
- Issue date Mar 25, 2025
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 12,238,866
- Issue date Feb 25, 2025
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery charger including an isolating member
- Patent number 12,212,169
- Issue date Jan 28, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. Silha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Thermal Management Enhancement of Electronic Components
- Publication number 20250240867
- Publication date Jul 24, 2025
- Wolfspeed, Inc.
- Kenneth P. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250240866
- Publication date Jul 24, 2025
- Sony Interactive Entertainment Inc.
- Takayuki HACHIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Cooling Using PCB Through Holes
- Publication number 20250240878
- Publication date Jul 24, 2025
- Jordan K. Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE-LEVEL THERMAL MANAGEMENT MECHANISM
- Publication number 20250234452
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Mark A. Tverdy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250234451
- Publication date Jul 17, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP BOARD GROUND PLANE IMPEDANCE MATCHING ADJUSTMENT
- Publication number 20250226561
- Publication date Jul 10, 2025
- MACOM Technology Solutions Holdings, Inc.
- Benone Achiriloaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER-INTEGRATED ELECTRIC COMPRESSOR
- Publication number 20250215869
- Publication date Jul 3, 2025
- Sanden Corporation
- Toshimasa SHIMA
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250216614
- Publication date Jul 3, 2025
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20250214324
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi KISHIMOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MODULAR FRAMING SUSPENSION SYSTEM WITH SPRINGS AND PLASTIC SNAPS
- Publication number 20250220785
- Publication date Jul 3, 2025
- Whirlpool Corporation
- Cristian David Beltran Aponte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER
- Publication number 20250212312
- Publication date Jun 26, 2025
- Intel Corporation
- Jose DIAZ MARIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRFLOW IN A CARD-BASED COMPUTING DEVICE
- Publication number 20250212313
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Xiang SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...
- Publication number 20250212314
- Publication date Jun 26, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Yaniv Kazav
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250203762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES
- Publication number 20250193996
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Samuel R. Connor
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD
- Publication number 20250194054
- Publication date Jun 12, 2025
- CANAAN CREATIVE CO., LTD.
- Huan YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...
- Publication number 20250185151
- Publication date Jun 5, 2025
- NOF Corporation
- Toshinobu FUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR
- Publication number 20250185179
- Publication date Jun 5, 2025
- BlackBerry Limited
- Jason Wayne JANTZI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...
- Publication number 20250185176
- Publication date Jun 5, 2025
- Raytheon Company
- Charles Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK STRUCTURE
- Publication number 20250176139
- Publication date May 29, 2025
- KMW Inc.
- Duk Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING
- Publication number 20250176095
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Shubhangi TEWARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Customized thermal pathways in a PCB

Systems for dismantling of double-sided PCBA

Thermal management solution for power stage comprising top-cooled p...

Heat exchange method using fluorinated compounds having a low GWP

Baffles for electronic circuits immersed in cooling fluid in a tank

Gravity independent liquid cooling for electronics

Electronic module comprising a pulsating heat pipe

Display device with slim control assembly

Electronic assemblies having embedded passive heat pipes and associ...

Printed circuit board (PCB) cooling

Display panel and display device including the same

High capacitance memory device

Multilayer resin substrate and electronic component

Power electronics assemblies having power electronics devices embed...

Power module with housed power semiconductors for controllable elec...

Assembly comprising a circuit carrier and a heat sink

Support assembly, unit, and light module for a motor vehicle lighti...

Dual-sided expansion card with offset slot alignment

Heat sinks with beyond-board fins

Multi-layer line structure

Component carrier with embedded semiconductor component and embedde...

Heatsink techniques for optical and electrical modules

Motor controller heat dissipating systems and methods

Systems and methods providing high-density memory arrangements with...

Power semiconductor device and method for manufacturing power semic...

Electronic control device

Electronic device

Circuit board

Battery charger including an isolating member

Beveled overburden for vias and method of making the same

Patents Applicationslast 30 patents

Thermal Management Enhancement of Electronic Components

ELECTRONIC DEVICE

Liquid Cooling Using PCB Through Holes

MODULE-LEVEL THERMAL MANAGEMENT MECHANISM

PRINTED CIRCUIT BOARD ASSEMBLY

MICROSTRIP BOARD GROUND PLANE IMPEDANCE MATCHING ADJUSTMENT

INVERTER-INTEGRATED ELECTRIC COMPRESSOR

WIRING SUBSTRATE

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

MODULAR FRAMING SUSPENSION SYSTEM WITH SPRINGS AND PLASTIC SNAPS

PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER

SUBSTRATE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER LINE STRUCTURE

AIRFLOW IN A CARD-BASED COMPUTING DEVICE

DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERF...

Thermal Management in Circuit Board Assemblies

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES

PRINTED CIRCUIT BOARD

HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...

HEAT SINK STRUCTURE

BATTERY CHARGER

MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING