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ELECTRONIC DEVICE AND PACKAGE STRUCTURE
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Publication number 20240155758
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Publication date May 9, 2024
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Advanced Semiconductor Engineering, Inc.
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Chien Lin CHANG CHIEN
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
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Publication number 20240138103
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Publication date Apr 25, 2024
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Huawei Digital Power Technologies Co., Ltd.
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Qiang Gao
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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BATTERY CHARGER
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Publication number 20240128773
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Publication date Apr 18, 2024
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Milwaukee Electric Tool Corporation
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Wyatt R. SILHA
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H01 - BASIC ELECTRIC ELEMENTS
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UNIVERSAL RUGGEDIZED COMPUTER SYSTEM ENCLOSURE
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Publication number 20240114653
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Publication date Apr 4, 2024
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United States of America as Represented by The Secretary of The Army
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Joshua D. Wattier
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G06 - COMPUTING CALCULATING COUNTING
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MEMORY SUB-SYSTEM ENCLOSURE
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Publication number 20240107657
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Publication date Mar 28, 2024
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Micron Technology, Inc.
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Suresh Reddy Yarragunta
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC DEVICE
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Publication number 20240098880
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Publication date Mar 21, 2024
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KMW Inc.
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Bae Mook JEONG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC DEVICE
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Publication number 20240098872
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Publication date Mar 21, 2024
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ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
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Uwe WALTRICH
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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LAMINATE AND ELECTRONIC DEVICE
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Publication number 20240049386
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Publication date Feb 8, 2024
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FUJIFILM CORPORATION
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Akio KATAYAMA
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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CIRCUIT ASSEMBLY
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Publication number 20240032210
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Publication date Jan 25, 2024
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AUTONETWORKS TECHNOLOGIES, LTD.
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Taiji YANAGIDA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Heat Sink Component Terminations
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Publication number 20240032185
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Publication date Jan 25, 2024
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KYOCERA AVX Components Corporation
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Cory Nelson
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PRINTED CIRCUIT BOARD (PCB) COOLING
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Publication number 20240015881
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Publication date Jan 11, 2024
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HAMILTON SUNDSTRAND CORPORATION
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Yongduk Lee
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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DYNAMIC CONTROL OF HEAT SINK PRESSURE
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Publication number 20240015880
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Publication date Jan 11, 2024
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Cisco Technology, Inc.
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Rohit Dev Gupta
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR