Thermal management

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CPC
H05K7/207

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/207Thermal management

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device and server
- Patent number 12,178,002
- Issue date Dec 24, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Ya-Ting Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coolant system for a busbar assembly
- Patent number 12,178,019
- Issue date Dec 24, 2024
- TE CONNECTIVITY SOLUTIONS GMBH ET AL.
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crossbar and sled for a modular server and/or information handling...
- Patent number 12,171,081
- Issue date Dec 17, 2024
- ZT GROUP INT'L, INC.
- Michael Dennis Marcade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system and electronic device
- Patent number 12,167,578
- Issue date Dec 10, 2024
- NEC Platforms, Ltd.
- Satoshi Isoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile high performance computing platform for cryptocurrency mining
- Patent number 12,167,569
- Issue date Dec 10, 2024
- DaVinci 3.0 Incorporated
- Patrick J. Sweeney
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pluggable module and cage for improving airflow in network switch s...
- Patent number 12,167,577
- Issue date Dec 10, 2024
- Arista Networks, Inc.
- Youngbae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-way flow controller paths for single-phase and two-phase cool...
- Patent number 12,160,981
- Issue date Dec 3, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply device
- Patent number 12,160,980
- Issue date Dec 3, 2024
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Bing Fan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Manifold for liquid cooled computing systems
- Patent number 12,156,374
- Issue date Nov 26, 2024
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Housing structure
- Patent number 12,156,380
- Issue date Nov 26, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Ming Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underwater data centers with environmental information system
- Patent number 12,156,366
- Issue date Nov 26, 2024
- Brendan Hyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density chassis supporting replaceable hardware accelerators
- Patent number 12,156,363
- Issue date Nov 26, 2024
- Dell Products, L.P.
- Walter R. Carver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Server stand and server assembly using the same
- Patent number 12,156,375
- Issue date Nov 26, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Yen-Lu Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for redundant data centers
- Patent number 12,156,382
- Issue date Nov 26, 2024
- Mark Edward Oxley
- G05 - CONTROLLING REGULATING
Information Patent Grant
System comprising a rack, with support members and components inser...
- Patent number 12,156,362
- Issue date Nov 26, 2024
- OVH
- Jules Hermann Bonenfant
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fluid immersion cooling
- Patent number 12,156,371
- Issue date Nov 26, 2024
- CGG SERVICES SAS
- Laurent Clerc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling assembly for a data center rack and method for assembling a...
- Patent number 12,150,283
- Issue date Nov 19, 2024
- OVH
- Gregory Francis Louis Bauchart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Height-adjustable server air guide hood and server
- Patent number 12,150,281
- Issue date Nov 19, 2024
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Liqiang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for recapturing waste heat from computing devices
- Patent number 12,144,154
- Issue date Nov 12, 2024
- CORE SCIENTIFIC, INC.
- Harsh Patel
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Cooling system and electronic device
- Patent number 12,137,538
- Issue date Nov 5, 2024
- NEC Platforms, Ltd.
- Yasuhito Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced fan integration in data storage systems
- Patent number 12,137,541
- Issue date Nov 5, 2024
- Sanmina Corporation
- Odie Banks Killen
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for maintaining cooling of modular electronic...
- Patent number 12,137,530
- Issue date Nov 5, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adjustable airflow duct
- Patent number 12,137,532
- Issue date Nov 5, 2024
- MasterCard International Incorporated
- Michael LaTorre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for preventing incorrect mounting and installati...
- Patent number 12,133,355
- Issue date Oct 29, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Pao-Ching Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SERVER COOLING WITH IMMERSED HEAT SINK
- Publication number 20240431070
- Publication date Dec 26, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN FREE SUPPORT FREE OF ASSEMBLY AND DISASSEMBLY TOOLS
- Publication number 20240422937
- Publication date Dec 19, 2024
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Heng LV
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPACE SAVING DATA CENTER SYSTEM
- Publication number 20240414889
- Publication date Dec 12, 2024
- Rodion Davydov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT MODULE AND COMPUTING DEVICE
- Publication number 20240414872
- Publication date Dec 12, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- CHANG-JU WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE AND SERVER
- Publication number 20240414879
- Publication date Dec 12, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE ADJUSTMENT MODULE
- Publication number 20240414887
- Publication date Dec 12, 2024
- GIGA-BYTE TECHNOLOGY CO.,LTD.
- Chih-Hua Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM
- Publication number 20240414873
- Publication date Dec 12, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20240414890
- Publication date Dec 12, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVICEABLE PERIPHERAL CONNECTION DEVICE
- Publication number 20240414888
- Publication date Dec 12, 2024
- Microsoft Technology Licensing, LLC
- Adam Kristopher SPIEGELMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
JOINT MODULE AND SERVER SYSTEM
- Publication number 20240414891
- Publication date Dec 12, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- CHANG-JU WU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SERVER DEVICE AND COOLING APPARATUS
- Publication number 20240407131
- Publication date Dec 5, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiaqing JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACOUSTIC FAN CASING SYSTEM
- Publication number 20240401612
- Publication date Dec 5, 2024
- VERTIV CORPORATION
- Balar Rampati Singh
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR
- Publication number 20240407127
- Publication date Dec 5, 2024
- Intel Corporation
- Douglas HEYMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANIFOLD ASSEMBLY AND MANIFOLD
- Publication number 20240407130
- Publication date Dec 5, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Biao LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING FAN BASED ON TEMPERATURE VARIATION TREND
- Publication number 20240407141
- Publication date Dec 5, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- BIAO LI
- G05 - CONTROLLING REGULATING
Information Patent Application
REDUCING ENERGY CONSUMED FOR COOLING EQUIPMENT IN AN EDGE CONTAINER
- Publication number 20240397672
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Dustin Demetriou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING DEVICE AND SERVER
- Publication number 20240397673
- Publication date Nov 28, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-CHIA TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER DATA CENTER RACK ASSEMBLY
- Publication number 20240397658
- Publication date Nov 28, 2024
- MacStadium, Inc.
- Corey Layton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COMPUTER CABINET COOLING
- Publication number 20240389261
- Publication date Nov 21, 2024
- VERTIV CORPORATION
- Denis Rancic
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION APPARATUS AND SERVER
- Publication number 20240389262
- Publication date Nov 21, 2024
- Huawei Technologies Co., Ltd
- Dingfang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID
- Publication number 20240384936
- Publication date Nov 21, 2024
- Inertech IP LLC
- Ming Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Accurate Estimation of Data Center Cooling Capacity with a Cooling...
- Publication number 20240386158
- Publication date Nov 21, 2024
- Google LLC
- Vasileios Kontorinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...
- Publication number 20240389275
- Publication date Nov 21, 2024
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR LIQUID COOLING FOR MULTI-NODE COMPUTING SYSTEMS
- Publication number 20240389276
- Publication date Nov 21, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER WITH A SWITCH CABINET ROW ARRANGED IN A CONTAINER AND A...
- Publication number 20240381583
- Publication date Nov 14, 2024
- RITTAL GMBH & CO. KG
- Jan MESCHKAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...
- Publication number 20240381585
- Publication date Nov 14, 2024
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR AIR COOLING AND DISTRIBUTION SYSTEMS AND METHODS
- Publication number 20240381588
- Publication date Nov 14, 2024
- Inertech IP LLC
- John Costakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER COOLING USING SPRAYED FLUID AND HIGH CONDUCTIVITY GAS OR AIR
- Publication number 20240381571
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Hariharan KUMAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management and Control System
- Publication number 20240381579
- Publication date Nov 14, 2024
- Scott Agnew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation device and server

Coolant system for a busbar assembly

Crossbar and sled for a modular server and/or information handling...

Rack system for housing at least one immersion case

Cooling system and electronic device

Mobile high performance computing platform for cryptocurrency mining

Pluggable module and cage for improving airflow in network switch s...

Three-way flow controller paths for single-phase and two-phase cool...

Power supply device

Manifold for liquid cooled computing systems

Housing structure

Devices, systems, and methods for a hybrid cooling system

Underwater data centers with environmental information system

High-density chassis supporting replaceable hardware accelerators

Rack system for housing an electronic device

Server stand and server assembly using the same

Systems and methods for redundant data centers

System comprising a rack, with support members and components inser...

Methods and systems for fluid immersion cooling

Liquid submerged, horizontal computer server rack and systems and m...

Cooling assembly for a data center rack and method for assembling a...

Height-adjustable server air guide hood and server

Data center rack system with integrated liquid and dielectric immer...

System for recapturing waste heat from computing devices

Cooling system and electronic device

Enhanced fan integration in data storage systems

Method and apparatus for maintaining cooling of modular electronic...

Adjustable airflow duct

Microelectronic module

Mounting structure for preventing incorrect mounting and installati...

Patents Applicationslast 30 patents

SERVER COOLING WITH IMMERSED HEAT SINK

FAN FREE SUPPORT FREE OF ASSEMBLY AND DISASSEMBLY TOOLS

SPACE SAVING DATA CENTER SYSTEM

JOINT MODULE AND COMPUTING DEVICE

LIQUID COOLING PLATE AND SERVER

TEMPERATURE ADJUSTMENT MODULE

SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM

LIQUID COOLING PLATE ASSEMBLY AND SERVER

SERVICEABLE PERIPHERAL CONNECTION DEVICE

JOINT MODULE AND SERVER SYSTEM

SERVER DEVICE AND COOLING APPARATUS

ACOUSTIC FAN CASING SYSTEM

AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR

MANIFOLD ASSEMBLY AND MANIFOLD

Sealed Rack Server Unit

METHOD FOR CONTROLLING FAN BASED ON TEMPERATURE VARIATION TREND

REDUCING ENERGY CONSUMED FOR COOLING EQUIPMENT IN AN EDGE CONTAINER

LIQUID COOLING DEVICE AND SERVER

COMPUTER DATA CENTER RACK ASSEMBLY

SYSTEMS AND METHODS FOR COMPUTER CABINET COOLING

HEAT DISSIPATION APPARATUS AND SERVER

COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID

Accurate Estimation of Data Center Cooling Capacity with a Cooling...

DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...

MODULAR LIQUID COOLING FOR MULTI-NODE COMPUTING SYSTEMS

DATA CENTER WITH A SWITCH CABINET ROW ARRANGED IN A CONTAINER AND A...

DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...

MODULAR AIR COOLING AND DISTRIBUTION SYSTEMS AND METHODS

SERVER COOLING USING SPRAYED FLUID AND HIGH CONDUCTIVITY GAS OR AIR

Thermal Management and Control System