Thermal paths through the printed circuit board [PCB]

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CPC
H05K7/205

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/205Thermal paths through the printed circuit board [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component caddies
- Patent number 12,326,763
- Issue date Jun 10, 2025
- Hewlett-Packard Development Company, L.P.
- Ming-Shan Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit card assemblies
- Patent number 12,328,847
- Issue date Jun 10, 2025
- Ametek, Inc.
- Joo-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for controlling heat transfer between components
- Patent number 12,328,848
- Issue date Jun 10, 2025
- Battelle Savannah River Alliance, LLC
- John T. Bobbitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuating heatsink for pluggable modules
- Patent number 12,324,129
- Issue date Jun 3, 2025
- Juniper Networks, Inc.
- Jimmy Chun-Chuen Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Management with a liquid metal embedded elastomer
- Patent number 12,309,977
- Issue date May 20, 2025
- Dell Products L.P.
- Duck-Soo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extruded heat pipe
- Patent number 12,303,957
- Issue date May 20, 2025
- Intel Corporation
- Christopher Michael Moore
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Handheld electronic device
- Patent number 12,301,744
- Issue date May 13, 2025
- Apple Inc.
- David A. Hurrell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic equipment cabinets with configurable air plenums
- Patent number 12,289,867
- Issue date Apr 29, 2025
- VERTIV CORPORATION
- Jin Harrison Elkins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus including thermal management mechanism and methods of man...
- Patent number 12,284,788
- Issue date Apr 22, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Highly integrated mobile energy storage system
- Patent number 12,284,789
- Issue date Apr 22, 2025
- SUNGROW POWER SUPPLY CO., LTD.
- Hongsheng Dou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system hybrid heat block keyboard
- Patent number 12,282,611
- Issue date Apr 22, 2025
- Po Hung Chi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Engineered actuators usable in MEMs active cooling devices
- Patent number 12,274,035
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Vikram Mukundan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile terminal
- Patent number 12,250,793
- Issue date Mar 11, 2025
- Huawei Technoloiges Co., Ltd.
- Siqiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation shield with zipper
- Patent number 12,250,800
- Issue date Mar 11, 2025
- Intel Corporation
- Yew San Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure for optoelectronic module and electronic...
- Patent number 12,242,121
- Issue date Mar 4, 2025
- Ruijie Networks Co., Ltd.
- Xiaolong Lv
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation cabinet and communication device
- Patent number 12,245,403
- Issue date Mar 4, 2025
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhisheng Lian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and apparatus for managing heat distribution in a semiconduc...
- Patent number 12,238,898
- Issue date Feb 25, 2025
- Ciena Corporation
- Charles Baudot
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal management of high heat flux multicomponent assembly
- Patent number 12,238,899
- Issue date Feb 25, 2025
- Henkel AG & Co. KGaA
- Radesh Jewram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface card assembly and circuit board module using the same
- Patent number 12,237,618
- Issue date Feb 25, 2025
- ASUSTeK COMPUTER Inc.
- Po-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,222,783
- Issue date Feb 11, 2025
- Getac Technology Corporation
- Wan-Lin Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for securing and releasing a first module and a second modul...
- Patent number 12,218,402
- Issue date Feb 4, 2025
- Huawei Technologies Co., Ltd.
- Niklas Lekselius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a liquid cooling assembly of a family of liqu...
- Patent number 12,219,733
- Issue date Feb 4, 2025
- OVH
- Hadrien Bauduin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Airflow guiding mechanism and electronic device
- Patent number 12,207,448
- Issue date Jan 21, 2025
- Wistron Corporation
- Yu-Chia Cheng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
IMMERSION-TYPE HEAT DISSIPATING DEVICE
- Publication number 20250176137
- Publication date May 29, 2025
- COOLER MASTER., LTD.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING ASSEMBLY FOR CIRCUIT
- Publication number 20250168964
- Publication date May 22, 2025
- Schneider Electric (China) Co., Ltd.
- Zhibao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL SYSTEM AND ELECTRICAL DRIVE UNIT
- Publication number 20250151243
- Publication date May 8, 2025
- SCHAEFFLER TECHNOLOGIES AG & CO. KG
- Johannes Herrmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE COMPRISING HEAT TRANSFER MEMBER
- Publication number 20250138328
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jongkyun IM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING PLATE AND COOLING SYSTEM
- Publication number 20250142771
- Publication date May 1, 2025
- NIO Technology (Anhui) Co., Ltd.
- Bradley J. Angier
- B60 - VEHICLES IN GENERAL
Information Patent Application
EQUIPMENT RACK ARRANGEMENT
- Publication number 20250126738
- Publication date Apr 17, 2025
- SCHNEIDER ELECTRIC IT CORPORATION
- Stuart Michael Sheehan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...
- Publication number 20250089153
- Publication date Mar 13, 2025
- Delta Electronics, Inc.
- Jui-Chien HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20250089219
- Publication date Mar 13, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERSONAL CARE COMPOSITIONS INCLUDING ANTIPERSPIRANT, DEODORANT, AND...
- Publication number 20250089218
- Publication date Mar 13, 2025
- ELEMENTIS SPECIALTIES, INC.
- Rey ORDIALES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM SHEET WITH DIELECTRIC COATING ISOLATION BARRIER
- Publication number 20250081398
- Publication date Mar 6, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Nhia Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE CIRCUIT CARD GUIDES
- Publication number 20250081374
- Publication date Mar 6, 2025
- Rockwell Collins, Inc.
- Richard J. Musiol
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER ASSEMBLY APPARATUS AND LIQUID COOLING CONVERTER THEREOF
- Publication number 20250081413
- Publication date Mar 6, 2025
- Xiamen Kehua Digital Energy Tech Co.,Ltd
- Ligui Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIMITING STRUCTURE AND LIMITING METHOD THEREOF
- Publication number 20250081399
- Publication date Mar 6, 2025
- FIVEGRAND INTERNATIONAL CO., LTD.
- TING-JUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DE...
- Publication number 20250081400
- Publication date Mar 6, 2025
- HUAWEI TECHNOLOGIES CO., LTD.
- Zhi HE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL UNIT
- Publication number 20250081402
- Publication date Mar 6, 2025
- DENSO CORPORATION
- Hiroki CHITAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL UNIT
- Publication number 20250081401
- Publication date Mar 6, 2025
- DENSO CORPORATION
- Hiroki CHITAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT HYBRID HEAT CAPTURE SYSTEM IN AN INFORMATION HANDLING SYSTEM
- Publication number 20250081403
- Publication date Mar 6, 2025
- Dell Products L.P.
- Timothy A. Shedd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20250071938
- Publication date Feb 27, 2025
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250070654
- Publication date Feb 27, 2025
- LS ELECTRIC CO., LTD.
- Bo Sun SONG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SELF-ADJUSTING FLUID COOLING SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20250063691
- Publication date Feb 20, 2025
- SUGON DATAENERGY (BEIJING) CO., LTD.
- Peng Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Contact Fluid Based Cooling Module
- Publication number 20250056759
- Publication date Feb 13, 2025
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SERVERS WITH VELOCITY AUGMENTATION USING PARTIAL BY-PASS AI...
- Publication number 20250056768
- Publication date Feb 13, 2025
- Dynamic Data Centers Solutions, Inc.
- Mark David Ortenzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...
- Publication number 20250056732
- Publication date Feb 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CONNECTOR
- Publication number 20250048597
- Publication date Feb 6, 2025
- YAZAKI CORPORATION
- Hideki HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE
- Publication number 20250048596
- Publication date Feb 6, 2025
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250048584
- Publication date Feb 6, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Hirokazu TAKABAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20250031350
- Publication date Jan 23, 2025
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODULE MOUNTING DEVICE AND INFORMATION PROCESSING APPARATUS
- Publication number 20250024646
- Publication date Jan 16, 2025
- Fujitsu Limited
- Nobuyuki HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250024634
- Publication date Jan 16, 2025
- Nintendo Co., Ltd.
- Takafumi NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal paths through the printed circuit board [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component caddies

Circuit card assemblies

Systems and methods for controlling heat transfer between components

Actuating heatsink for pluggable modules

Management with a liquid metal embedded elastomer

Extruded heat pipe

Handheld electronic device

Electronic equipment cabinets with configurable air plenums

Apparatus including thermal management mechanism and methods of man...

Highly integrated mobile energy storage system

Information handling system hybrid heat block keyboard

Engineered actuators usable in MEMs active cooling devices

Heatsink for co-packaged optical switch rack package

Heat sinks with beyond-board fins

Mobile terminal

Radiation shield with zipper

Heat dissipation structure for optoelectronic module and electronic...

Heat dissipation cabinet and communication device

Heatsink techniques for optical and electrical modules

Motor controller heat dissipating systems and methods

Method and apparatus for managing heat distribution in a semiconduc...

Thermal management of high heat flux multicomponent assembly

Interface card assembly and circuit board module using the same

Nanosecond pulser ADC system

Power semiconductor device and method for manufacturing power semic...

Electronic control device

Electronic device

Device for securing and releasing a first module and a second modul...

Method for assembling a liquid cooling assembly of a family of liqu...

Airflow guiding mechanism and electronic device

Patents Applicationslast 30 patents

IMMERSION-TYPE HEAT DISSIPATING DEVICE

HEAT DISSIPATING ASSEMBLY FOR CIRCUIT

Heatsink techniques for optical and electrical modules

ELECTRICAL SYSTEM AND ELECTRICAL DRIVE UNIT

WEARABLE ELECTRONIC DEVICE COMPRISING HEAT TRANSFER MEMBER

COOLING PLATE AND COOLING SYSTEM

EQUIPMENT RACK ARRANGEMENT

SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

PERSONAL CARE COMPOSITIONS INCLUDING ANTIPERSPIRANT, DEODORANT, AND...

ALUMINUM SHEET WITH DIELECTRIC COATING ISOLATION BARRIER

THERMALLY CONDUCTIVE CIRCUIT CARD GUIDES

POWER ASSEMBLY APPARATUS AND LIQUID COOLING CONVERTER THEREOF

LIMITING STRUCTURE AND LIMITING METHOD THEREOF

HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DE...

ELECTRONIC CONTROL UNIT

ELECTRONIC CONTROL UNIT

COMPACT HYBRID HEAT CAPTURE SYSTEM IN AN INFORMATION HANDLING SYSTEM

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

POWER CONVERSION APPARATUS

SELF-ADJUSTING FLUID COOLING SYSTEM FOR ELECTRONIC DEVICE

Direct Contact Fluid Based Cooling Module

COOLING SERVERS WITH VELOCITY AUGMENTATION USING PARTIAL BY-PASS AI...

SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...

CONNECTOR

SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE

ELECTRONIC DEVICE

CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS

MODULE MOUNTING DEVICE AND INFORMATION PROCESSING APPARATUS

ELECTRONIC APPARATUS