Thermal paths through the printed circuit board [PCB]

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CPC
H05K7/205

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/205Thermal paths through the printed circuit board [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Casing and electronic device
- Patent number 12,167,576
- Issue date Dec 10, 2024
- ZTE Corporation
- Zhifeng Zhu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Storage system
- Patent number 12,166,320
- Issue date Dec 10, 2024
- Kioxia Corporation
- Kazuyuki Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of 3D-printing a circuit board on a heat sink a...
- Patent number 12,156,344
- Issue date Nov 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Heater with mounting pads for mechanical, thermal, and opto-mechani...
- Patent number 12,155,980
- Issue date Nov 26, 2024
- Lumentum Operations LLC
- Roozbeh Ahmadi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat dissipation device of electronic equipment
- Patent number 12,156,381
- Issue date Nov 26, 2024
- Techway Industrial Co., Ltd.
- Fu Hsiang Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Containment system for electronics racks
- Patent number 12,150,268
- Issue date Nov 19, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to help mitigate heat in an electronic device
- Patent number 12,150,280
- Issue date Nov 19, 2024
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Centrally anchored MEMS-based active cooling systems
- Patent number 12,137,540
- Issue date Nov 5, 2024
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module with improved cooling
- Patent number 12,133,366
- Issue date Oct 29, 2024
- Danfoss Silicon Power GmbH
- Stefan Behrendt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Photosensitive assembly, camera module and electronic device
- Patent number 12,133,364
- Issue date Oct 29, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Chao Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular mass storage system
- Patent number 12,124,394
- Issue date Oct 22, 2024
- Amazon Technologies, Inc.
- Darin Lee Frink
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-capacity memory air cooling device
- Patent number 12,124,302
- Issue date Oct 22, 2024
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Jeffrey S Holland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Outlet quality factor stabilization for datacenter cooling systems
- Patent number 12,127,381
- Issue date Oct 22, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Container for one or more electronic devices and methods of use the...
- Patent number 12,120,847
- Issue date Oct 15, 2024
- Engendren LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including heat dissipation structure
- Patent number 12,120,853
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Junwhon Uhm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Antenna assembly for a vehicle
- Patent number 12,113,267
- Issue date Oct 8, 2024
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interposer for electronic device
- Patent number 12,108,576
- Issue date Oct 1, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-aligning heat fins for thermal management
- Patent number 12,108,577
- Issue date Oct 1, 2024
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Variable topography heat sink fins
- Patent number 12,101,913
- Issue date Sep 24, 2024
- Dell Products L.P.
- Timothy M. Lambert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Intelligent pod-based cooling loop with dry cooler for mobile datac...
- Patent number 12,101,907
- Issue date Sep 24, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation subrack, heat dissipation cabinet, and backplane c...
- Patent number 12,096,592
- Issue date Sep 17, 2024
- Xi'an Zhongxing New Software Co., Ltd.
- Jun Wei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cold plate and system for cooling electronic devices
- Patent number 12,096,595
- Issue date Sep 17, 2024
- ICEOTOPE GROUP LIMITED
- Alexander Cushen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTOR
- Publication number 20240422948
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Jing-Xian Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING HEAT TRANSFER BETWEEN COMPONENTS
- Publication number 20240414886
- Publication date Dec 12, 2024
- BATTELLE SAVANNAH RIVER ALLIANCE, LLC
- JOHN T. BOBBITT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER...
- Publication number 20240414875
- Publication date Dec 12, 2024
- Crestron Electronics, Inc.
- Mark LaBosco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT
- Publication number 20240407138
- Publication date Dec 5, 2024
- SAGEMCOM BROADBAND SAS
- Nathan JEANROT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...
- Publication number 20240397669
- Publication date Nov 28, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INVERTER WITH CLOSED COOLING CHANNEL
- Publication number 20240389281
- Publication date Nov 21, 2024
- VIESSMANN CLIMATE SOLUTIONS SE
- Markus HOPF
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20240389278
- Publication date Nov 21, 2024
- YAZAKI CORPORATION
- Kazuki Shirosaka
- B60 - VEHICLES IN GENERAL
Information Patent Application
Thermal Management and Control System
- Publication number 20240381579
- Publication date Nov 14, 2024
- Scott Agnew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Switchgear Cabinet for Power Electronics
- Publication number 20240381592
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Martin Kautz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS
- Publication number 20240379328
- Publication date Nov 14, 2024
- Timothy M. Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE WITH LEAK DETECTOR AND RELATED SYSTEMS
- Publication number 20240361090
- Publication date Oct 31, 2024
- COOLIT SYSTEMS, INC.
- Mike Holden
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEM
- Publication number 20240357770
- Publication date Oct 24, 2024
- Transportation IP Holdings, LLC
- Brett Heher
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
HETEROGENOUS MULTI-LAYER STRUCTURE
- Publication number 20240357769
- Publication date Oct 24, 2024
- Tesla, Inc.
- Shishuang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...
- Publication number 20240349465
- Publication date Oct 17, 2024
- Lunar Energy, Inc.
- Steven Nicholas Grolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...
- Publication number 20240319456
- Publication date Sep 26, 2024
- Ruijie Networks Co., Ltd.
- Xiaolong LV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
- Publication number 20240314919
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Paul Theodore ARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CONNECTOR ATTACHMENT AND HEAT SINKING
- Publication number 20240305852
- Publication date Sep 12, 2024
- Dish Network L.L.C.
- Steven Nedved
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE
- Publication number 20240292572
- Publication date Aug 29, 2024
- LG Display Co., Ltd.
- Eunjeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Multilayer Module Having Low Inductance and Fast Switchi...
- Publication number 20240292575
- Publication date Aug 29, 2024
- Wolfspeed, Inc.
- Daniel Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE
- Publication number 20240276684
- Publication date Aug 15, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE HEAT DISSIPATION DEVICE
- Publication number 20240268081
- Publication date Aug 8, 2024
- TAIWAN MICROLOOPS CORP.
- Chun-Hung LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal-Control System Of A Mesh Network Device and Associated Mesh...
- Publication number 20240251498
- Publication date Jul 25, 2024
- Google LLC
- Ihab A. Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...
- Publication number 20240251528
- Publication date Jul 25, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRAVIOLET IRRADIATION APPARATUS AND ULTRAVIOLET IRRADIATION METHOD
- Publication number 20240238462
- Publication date Jul 18, 2024
- Asahi Kasei Kabushiki Kaisha
- Atsushi KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF HARDWARE COMPONENTS
- Publication number 20240237294
- Publication date Jul 11, 2024
- Dell Products L.P.
- ERIC MICHAEL TUNKS
- G06 - COMPUTING CALCULATING COUNTING

Thermal paths through the printed circuit board [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Casing and electronic device

Storage system

Systems and methods of 3D-printing a circuit board on a heat sink a...

Heater with mounting pads for mechanical, thermal, and opto-mechani...

Heat dissipation device of electronic equipment

Containment system for electronics racks

System and method to help mitigate heat in an electronic device

Electronic control of a compressor, compressor and cooling equipment

Centrally anchored MEMS-based active cooling systems

Electromagnetic interference shielding and thermal management syste...

Power electronics module with improved cooling

Cold plate architecture for liquid cooling of devices

Electronic systems with inverted circuit board with heat sink to ch...

Photosensitive assembly, camera module and electronic device

Flexible circuit board with thermally conductive connection to a he...

Modular mass storage system

Heatsink clamp for multiple electronic components

High-capacity memory air cooling device

Outlet quality factor stabilization for datacenter cooling systems

Container for one or more electronic devices and methods of use the...

Electronic device including heat dissipation structure

Heatsink with increased air flow

Antenna assembly for a vehicle

Thermal interposer for electronic device

Self-aligning heat fins for thermal management

Thermal management of electronics using co-located microjet nozzles...

Variable topography heat sink fins

Intelligent pod-based cooling loop with dry cooler for mobile datac...

Heat dissipation subrack, heat dissipation cabinet, and backplane c...

Cold plate and system for cooling electronic devices

Patents Applicationslast 30 patents

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

ELECTRIC CONNECTOR

SYSTEMS AND METHODS FOR CONTROLLING HEAT TRANSFER BETWEEN COMPONENTS

DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER...

THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT

PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...

INVERTER WITH CLOSED COOLING CHANNEL

ELECTRICAL JUNCTION BOX AND WIRE HARNESS

Thermal Management and Control System

Switchgear Cabinet for Power Electronics

PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

COOLING MODULE WITH LEAK DETECTOR AND RELATED SYSTEMS

THERMAL MANAGEMENT SYSTEM

HETEROGENOUS MULTI-LAYER STRUCTURE

THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...

HEAT SPREADER FOR MODIFIED EDGE COOLING

HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...

ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT

MAGNETIC CONNECTOR ATTACHMENT AND HEAT SINKING

DISPLAY DEVICE

High Power Multilayer Module Having Low Inductance and Fast Switchi...

BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

COMPOSITE HEAT DISSIPATION DEVICE

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

Thermal-Control System Of A Mesh Network Device and Associated Mesh...

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...

ULTRAVIOLET IRRADIATION APPARATUS AND ULTRAVIOLET IRRADIATION METHOD

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF HARDWARE COMPONENTS