thermal treatment

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H01L21/76828

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76828thermal treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,125,744
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,057,345
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interlevel dielectric layer with regions o...
- Patent number 11,955,421
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,437
- Issue date Feb 13, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,894,266
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with covering liners
- Patent number 11,894,264
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor device with interconnect part
- Patent number 11,881,453
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having a plurality of threshold volt...
- Patent number 11,837,602
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-San Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,817,384
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semicondcutor device using carbon containing sp...
- Patent number 11,804,404
- Issue date Oct 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen Lay
- G11 - INFORMATION STORAGE
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 11,791,154
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 11,749,563
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,695,080
- Issue date Jul 4, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,670,546
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with air gap
- Patent number 11,658,063
- Issue date May 23, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with covering liners and method for fabricatin...
- Patent number 11,610,811
- Issue date Mar 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 11,594,455
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,581,218
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 11,532,506
- Issue date Dec 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Hung-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,527,435
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,495,533
- Issue date Nov 8, 2022
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240420994
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...
- Publication number 20240413075
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387252
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH CONTROLLED GATE CONTACT PROFILE
- Publication number 20240332063
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240258159
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS O...
- Publication number 20240250018
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240249975
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMOLDING OF ELECTRICAL INTERCONNECTS
- Publication number 20240178141
- Publication date May 30, 2024
- Cornell University
- Mehrdad Kiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
- Publication number 20240162083
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240154026
- Publication date May 9, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING OF SEMICONDUCTOR DEVICE
- Publication number 20240120275
- Publication date Apr 11, 2024
- SK HYNIX INC.
- Seong Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240063126
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Chen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006232
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen LAY
- G11 - INFORMATION STORAGE
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20230411150
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20230369106
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230274975
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230260830
- Publication date Aug 17, 2023
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH INTERCONNECT PART
- Publication number 20230223340
- Publication date Jul 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230215765
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-NAN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230187270
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20230187276
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS
- Publication number 20230178424
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230123652
- Publication date Apr 20, 2023
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen LAY
- G11 - INFORMATION STORAGE
Information Patent Application
Metal Capping Layer and Methods Thereof
- Publication number 20230112282
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MULTIPLE BEOL K-VALUE DIELECTRIC
- Publication number 20230061546
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230043650
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS

thermal treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cyclic spin-on coating process for forming dielectric material

Semiconductor device with composite conductive features and method...

Etch profile control of gate contact opening

Method of dielectric material fill and treatment

Structure and method for interlevel dielectric layer with regions o...

Semiconductor device including a porous dielectric layer, and metho...

Bonding method of package components and bonding apparatus

Semiconductor device and method of fabricating the same

Semiconductor device and method for fabricating the same

Bilayer seal material for air gaps in semiconductor devices

Metal capping layer and methods thereof

Method for fabricating semiconductor device with covering liners

Method for preparing a semiconductor device with interconnect part

Semiconductor device structure having a plurality of threshold volt...

Interconnect structure and manufacturing method for the same

Method of forming a semicondcutor device using carbon containing sp...

Cyclic spin-on coating process for forming dielectric material

Interlayer dielectric layer

Semiconductor device and method for manufacturing the same

Selective ILD deposition for fully aligned via with airgap

Semiconductor structure and manufacturing method thereof

Method for preparing semiconductor device structure with air gap

Method of dielectric material fill and treatment

Semiconductor device with covering liners and method for fabricatin...

Semiconductor device and manufacturing method for the same

Etch profile control of gate contact opening

Semiconductor device including a porous dielectric layer, and metho...

Integrated circuit structure

Metal capping layer and methods thereof

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

DEVICE WITH CONTROLLED GATE CONTACT PROFILE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS O...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

NANOMOLDING OF ELECTRICAL INTERCONNECTS

BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METAL WIRING OF SEMICONDUCTOR DEVICE

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Cyclic Spin-On Coating Process for Forming Dielectric Material

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH INTERCONNECT PART

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS

SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF

Metal Capping Layer and Methods Thereof

STRUCTURE AND METHOD FOR MULTIPLE BEOL K-VALUE DIELECTRIC

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME