Thermal treatment

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CPC
H01L21/76864

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76864Thermal treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for preparing semiconductor device structure with silicide p...
- Patent number 12,080,598
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for determining blocking ability of copper dif...
- Patent number 12,027,462
- Issue date Jul 2, 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Xiaobo Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,020,982
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,009,294
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL alternative metal interconnects: integration and process
- Patent number 11,990,414
- Issue date May 21, 2024
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide films through selective deposition
- Patent number 11,978,635
- Issue date May 7, 2024
- Applied Materials, Inc.
- Swaminathan Srinivasan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,923,242
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to wiring in a semiconductor device
- Patent number 11,923,291
- Issue date Mar 5, 2024
- Kioxia Corporation
- Atsushi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure manufacturing method
- Patent number 11,862,516
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Huiwen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 11,862,567
- Issue date Jan 2, 2024
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cobalt metalization
- Patent number 11,854,876
- Issue date Dec 26, 2023
- ASM IP Holding B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure
- Patent number 11,784,090
- Issue date Oct 10, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene layer for reduced contact resistance
- Patent number 11,721,627
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 11,715,689
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and fabrication method thereof
- Patent number 11,695,067
- Issue date Jul 4, 2023
- United Microelectronics Corp.
- Yen-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,670,579
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
- Patent number 11,664,427
- Issue date May 30, 2023
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for smoothing dynamic random access memory bi...
- Patent number 11,631,680
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for use in air gap formation
- Patent number 11,587,830
- Issue date Feb 21, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,574,840
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Takaaki Suzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and fabrication method thereof
- Patent number 11,557,666
- Issue date Jan 17, 2023
- United Microelectronics Corp.
- Yen-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Column IV transistors for PMOS integration
- Patent number 11,508,813
- Issue date Nov 22, 2022
- Daedalus Prime LLC
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer bonding method and structure thereof
- Patent number 11,502,058
- Issue date Nov 15, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312915
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20240297075
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240282698
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240222465
- Publication date Jul 4, 2024
- Magnachip Semiconductor, Ltd.
- Jungyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICAT...
- Publication number 20240213162
- Publication date Jun 27, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR METAL LINE IN SEMICONDUCTOR DEVICE, METAL LINE IN SEMI...
- Publication number 20240194604
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Eunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BASED HYDROGEN BARRIER
- Publication number 20240194526
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
- Publication number 20240162138
- Publication date May 16, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiyuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM METAL LINERS FOR INTERCONNECTS
- Publication number 20240153816
- Publication date May 9, 2024
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE
- Publication number 20230387018
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20230335438
- Publication date Oct 19, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230299009
- Publication date Sep 21, 2023
- STMicroelectronics (Crolles 2) SAS
- Fady ABOUZEID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20230282485
- Publication date Sep 7, 2023
- Aveni
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH SILICIDE P...
- Publication number 20230141895
- Publication date May 11, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH LINER THAT RESONATES DURING MICROWAVE ANNEAL
- Publication number 20230133484
- Publication date May 4, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING BLOCKING ABILITY OF COPPER DIF...
- Publication number 20230100023
- Publication date Mar 30, 2023
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xiaobo HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER BONDING METHOD
- Publication number 20230036495
- Publication date Feb 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20230027015
- Publication date Jan 26, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF
- Publication number 20230020271
- Publication date Jan 19, 2023
- UNITED MICROELECTRONICS CORP.
- Yen-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHODS THEREOF
- Publication number 20220415817
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES
- Publication number 20220415819
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, ELECTRONIC DEVICE INCLUDING THE SAME, AND M...
- Publication number 20220399228
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD
- Publication number 20220367348
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20220336271
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
- Publication number 20220293467
- Publication date Sep 15, 2022
- YUAN ZE UNIVERSITY
- Cheng EN HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Thermal treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing semiconductor device structure with silicide p...

Low resistance contacts including intermetallic alloy of nickel, pl...

Method and structure for barrier-less plug

Method and structure for determining blocking ability of copper dif...

Metal based hydrogen barrier

Middle-of-line interconnect structure and manufacturing method

Doped selective metal caps to improve copper electromigration with...

BEOL alternative metal interconnects: integration and process

Silicide films through selective deposition

Self-aligned barrier for metal vias

Method of manufacturing semiconductor device

Via connection to wiring in a semiconductor device

Rework for metal interconnects using etch and thermal anneal

Advanced copper interconnects with hybrid microstructure

Semiconductor structure manufacturing method

Low resistance contacts including intermetallic alloy of nickel, pl...

Systems and methods for cobalt metalization

Semiconductor structure

Graphene layer for reduced contact resistance

Method of forming metal interconnection

High electron mobility transistor and fabrication method thereof

Semiconductor structure and method of manufacturing the same

Vertical semiconductor device with enhanced contact structure and a...

Methods and apparatus for smoothing dynamic random access memory bi...

Integrated circuit device and method of manufacturing the same

Self-forming barrier for use in air gap formation

Semiconductor device and method of manufacturing semiconductor device

High electron mobility transistor and fabrication method thereof

Column IV transistors for PMOS integration

Hybrid wafer bonding method and structure thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD

SELF-ALIGNED BARRIER FOR METAL VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICAT...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

MATERIAL FOR METAL LINE IN SEMICONDUCTOR DEVICE, METAL LINE IN SEMI...

METAL BASED HYDROGEN BARRIER

METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE

METHODS TO FORM METAL LINERS FOR INTERCONNECTS

GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

ELECTRONIC DEVICE

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH SILICIDE P...

INTERCONNECTS WITH LINER THAT RESONATES DURING MICROWAVE ANNEAL

METHOD AND STRUCTURE FOR DETERMINING BLOCKING ABILITY OF COPPER DIF...

HYBRID WAFER BONDING METHOD

HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF

HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHODS THEREOF

DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES

INTERCONNECT STRUCTURE, ELECTRONIC DEVICE INCLUDING THE SAME, AND M...

MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES