Thermal treatments

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H01L2224/43848

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43848Thermal treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire
- Patent number 12,132,025
- Issue date Oct 29, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- C21 - METALLURGY OF IRON
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Al bonding wire
- Patent number 12,090,578
- Issue date Sep 17, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy bonding wire for semiconductor device
- Patent number 10,790,259
- Issue date Sep 29, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 10,622,531
- Issue date Apr 14, 2020
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damaging components with defective electrical couplings
- Patent number 10,529,632
- Issue date Jan 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,529,683
- Issue date Jan 7, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Damaging components with defective electrical couplings
- Patent number 10,103,072
- Issue date Oct 16, 2018
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alloyed 2N copper wires for bonding in microelectronics devices
- Patent number 9,589,694
- Issue date Mar 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali Sarangapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240071978
- Publication date Feb 29, 2024
- NIPPON MICROMETAL CORPORATION
- Yuya SUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al WIRING MATERIAL
- Publication number 20230299037
- Publication date Sep 21, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE
- Publication number 20220157766
- Publication date May 19, 2022
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200168578
- Publication date May 28, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGING COMPONENTS WITH DEFECTIVE ELECTRICAL COUPLINGS
- Publication number 20190013249
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE
- Publication number 20180345421
- Publication date Dec 6, 2018
- HERAEUS MATERIALS SINGAPORE PTE., LTD.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DAMAGING COMPONENTS WITH DEFECTIVE ELECTRICAL COUPLINGS
- Publication number 20180053696
- Publication date Feb 22, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER BONDING WIRE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170256517
- Publication date Sep 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Ki Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160104687
- Publication date Apr 14, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM COATED COPPER RIBBON
- Publication number 20150137390
- Publication date May 21, 2015
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Module and Method for Manufacturing the Same
- Publication number 20150076570
- Publication date Mar 19, 2015
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140329106
- Publication date Nov 6, 2014
- NIPPON MICROMETAL CORPORATION
- Ryo TOGASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER ALLOY WIRE FOR BONDING APPLICATIONS
- Publication number 20140063762
- Publication date Mar 6, 2014
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Jae-Sung RYU
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire

Bonding wire for semiconductor devices

Al bonding wire

Palladium-coated copper bonding wire, manufacturing method of palla...

Bonding wire for semiconductor devices

Coated wire

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy bonding wire for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Light-emitting device

Bonding wire for semiconductor device

Damaging components with defective electrical couplings

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Plastic-packaged semiconductor device having wires with polymerized...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Damaging components with defective electrical couplings

Copper-based alloy wire and methods for manufaturing the same

Bonding wire for high-speed signal line

Aluminum coated copper bond wire and method of making the same

Bonding wire for semiconductor device

Bonding wire for semiconductor devices

Alloyed 2N copper wires for bonding in microelectronics devices

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Al BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Al WIRING MATERIAL

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

DAMAGING COMPONENTS WITH DEFECTIVE ELECTRICAL COUPLINGS

COATED WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

DAMAGING COMPONENTS WITH DEFECTIVE ELECTRICAL COUPLINGS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SILVER BONDING WIRE AND METHOD OF MANUFACTURING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

ALUMINUM COATED COPPER RIBBON

Semiconductor Module and Method for Manufacturing the Same

BONDING WIRE AND METHOD FOR MANUFACTURING SAME

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

RELIABLE WIRE STRUCTURE AND METHOD

SILVER ALLOY WIRE FOR BONDING APPLICATIONS