Thermal treatments

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H01L2224/85948

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85948Thermal treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for increasing the reliability of a power module
- Patent number 11,929,346
- Issue date Mar 12, 2024
- Mitsubishi Electric Corporation
- Julio Cezar Brandelero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant copper bonds to aluminum
- Patent number 9,646,950
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,230,892
- Issue date Jan 5, 2016
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit including bond wire directly bonded to pad
- Patent number 8,432,024
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural element and process for its production including bonding...
- Patent number 6,916,739
- Issue date Jul 12, 2005
- Unaxis Balzers AG
- Jürgen Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for copper interconnects in semiconductor devices
- Patent number 6,790,757
- Issue date Sep 14, 2004
- Agere Systems Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Patent number 6,515,373
- Issue date Feb 4, 2003
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-based electrical interconnections for microelectronic devices
- Patent number 6,500,760
- Issue date Dec 31, 2002
- Sandia Corporation
- Kenneth A. Peterson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of application of copper solution in flip-chip, COB, and mic...
- Patent number 6,415,973
- Issue date Jul 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for ultra-fine pitch wire bonding
- Patent number 6,213,378
- Issue date Apr 10, 2001
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for obtaining metallurgical stability in integrated circuit...
- Patent number 5,455,195
- Issue date Oct 3, 1995
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device using annealed bonding wire
- Patent number 5,153,704
- Issue date Oct 6, 1992
- Hitachi, Ltd.
- Jin Onuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER MODULE
- Publication number 20230141711
- Publication date May 11, 2023
- Mitsubishi Electric Corporation
- Julio Cezar BRANDELERO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND STRENGTHENING
- Publication number 20160322329
- Publication date Nov 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
- Publication number 20110260307
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDING PROCESS
- Publication number 20110192885
- Publication date Aug 11, 2011
- NXP B.V.
- Hendrik Pieter HOCHSTENBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method for copper interconnects in semiconductor devices
- Publication number 20050035466
- Publication date Feb 17, 2005
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structural element and process for its production
- Publication number 20040087150
- Publication date May 6, 2004
- UNAXIS BALZERS AKTIENGESELLSCHAFT
- Jurgen Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire for semiconductor and method of manufacturing the bond...
- Publication number 20040014266
- Publication date Jan 22, 2004
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Publication number 20020084311
- Publication date Jul 4, 2002
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for increasing the reliability of a power module

Method of manufacturing semiconductor device

Waterfall wire bonding

Corrosion-resistant copper bonds to aluminum

Semiconductor device and method of manufacturing the same

Apparatus and methods for forming wire bonds

Integrated circuit including bond wire directly bonded to pad

Bonding wire for semiconductor device and method for producing the...

Structural element and process for its production including bonding...

Wire bonding method for copper interconnects in semiconductor devices

Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys

Gold-based electrical interconnections for microelectronic devices

Method of application of copper solution in flip-chip, COB, and mic...

Method and apparatus for ultra-fine pitch wire bonding

Method for obtaining metallurgical stability in integrated circuit...

Semiconductor device using annealed bonding wire

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRE BOND STRENGTHENING

WATERFALL WIRE BONDING

INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD

WIREBONDING PROCESS

APPARATUS AND METHODS FOR FORMING WIRE BONDS

Wire bonding method for copper interconnects in semiconductor devices

Structural element and process for its production

Bonding wire for semiconductor and method of manufacturing the bond...

Semiconductor device and method to produce the same

Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys