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H01L2224/82948
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/82948
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Patents Grants
last 30 patents
Information
Patent Grant
Preparation of compound semiconductor substrate for epitaxial growt...
Patent number
11,087,974
Issue date
Aug 10, 2021
The Regents of the University of Michigan
Stephen R. Forrest
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating semiconductor package
Patent number
11,031,371
Issue date
Jun 8, 2021
SanDisk Information Technology (Shanghai) Co., Ltd.
Chin Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
Patent number
8,790,742
Issue date
Jul 29, 2014
nScrypt, Inc.
Kenneth H. Church
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for filling a contact hole in a chip package arrangement an...
Patent number
8,728,873
Issue date
May 20, 2014
Infineon Technologies AG
Benjamin Alles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
Patent number
7,972,650
Issue date
Jul 5, 2011
nScrypt, Inc.
Kenneth H. Church
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Methods for filling a contact hole in a chip package arrangement an...
Publication number
20120061845
Publication date
Mar 15, 2012
INFINEON TECHNOLOGIES AG
Benjamin Alles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC C...
Publication number
20110237002
Publication date
Sep 29, 2011
nScrypt, Inc.
KENNETH H. CHURCH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR