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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/03848
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Patents Grants
last 30 patents
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Patent Grant
Flat metal features for microelectronics applications
Patent number
11,908,739
Issue date
Feb 20, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air gap
Patent number
11,830,837
Issue date
Nov 28, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
Patent number
11,688,713
Issue date
Jun 27, 2023
Infineon Technologies Austria AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor structure and method
Patent number
11,587,910
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
11,569,185
Issue date
Jan 31, 2023
Micron Technology, Inc.
Mitsunari Sukekawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,557,641
Issue date
Jan 17, 2023
Samsung Display Co., Ltd.
Byeong Beom Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,456,264
Issue date
Sep 27, 2022
Renesas Electronics Corporation
Yoshiaki Sato
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
Patent number
11,424,201
Issue date
Aug 23, 2022
Infineon Technologies AG
Michael Rogalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, electronic component and method
Patent number
11,380,612
Issue date
Jul 5, 2022
Infineon Technologies Austria AG
Matthias Stecher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including bonding pads and method of manufactu...
Patent number
11,380,638
Issue date
Jul 5, 2022
Kioxia Corporation
Masayoshi Tagami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for the electrical bonding of semiconductor components
Patent number
11,362,061
Issue date
Jun 14, 2022
Imec VZW
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device load terminal
Patent number
11,315,892
Issue date
Apr 26, 2022
Infineon Technologies AG
Roman Roth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of designing a layout, method of making a semiconductor stru...
Patent number
11,309,268
Issue date
Apr 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package with air gap and manufacturing method thereof
Patent number
11,302,662
Issue date
Apr 12, 2022
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for permanent connection of two metal surfaces
Patent number
11,282,801
Issue date
Mar 22, 2022
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
11,233,023
Issue date
Jan 25, 2022
Kabushiki Kaisha Toshiba
Hiroaki Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating the electronic component, and method for tra...
Patent number
11,069,638
Issue date
Jul 20, 2021
AU OPTRONICS CORPORATION
Yi-Cheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor structure and method
Patent number
11,037,909
Issue date
Jun 15, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structures with porous networks for solder connections, and...
Patent number
10,849,240
Issue date
Nov 24, 2020
Invensas Corporation
Liang Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flat metal features for microelectronics applications
Patent number
10,840,135
Issue date
Nov 17, 2020
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bonding pads for packaging applications
Patent number
10,825,792
Issue date
Nov 3, 2020
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
Patent number
10,734,297
Issue date
Aug 4, 2020
Mitsubishi Materials Corporation
Shuji Nishimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with post passivation structure
Patent number
10,727,191
Issue date
Jul 28, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device with metal structure electrically connected to...
Patent number
10,651,140
Issue date
May 12, 2020
Infineon Technologies AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor shielding for harsh media applications
Patent number
10,586,772
Issue date
Mar 10, 2020
Melexis Technologies NV
Appolonius Jacobus Van Der Wiel
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
Patent number
10,522,638
Issue date
Dec 31, 2019
Hitachi Power Semiconductor Device, Ltd.
Masakazu Sagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a porous metal layer and an electronic...
Patent number
10,515,910
Issue date
Dec 24, 2019
Infineon Technologies AG
Martin Mischitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor structure and method
Patent number
10,510,730
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flat metal features for microelectronics applications
Patent number
10,446,441
Issue date
Oct 15, 2019
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
Publication number
20240128216
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Lin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240006359
Publication date
Jan 4, 2024
KIOXIA Corporation
Akira NAKAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND SEMICOND...
Publication number
20230411320
Publication date
Dec 21, 2023
RENESAS ELECTRONICS CORPORATION
Tadashi YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20230207530
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
Publication number
20230048311
Publication date
Feb 16, 2023
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
Publication number
20220336394
Publication date
Oct 20, 2022
SANDISK TECHNOLOGIES LLC
Kensuke ISHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20220328437
Publication date
Oct 13, 2022
Rohm Co., Ltd.
Kazuki YOSHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME
Publication number
20220208702
Publication date
Jun 30, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka UZOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20220122930
Publication date
Apr 21, 2022
Micron Technology, Inc.
Mitsunari Sukekawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH AIR GAP
Publication number
20220077091
Publication date
Mar 10, 2022
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF
Publication number
20210343668
Publication date
Nov 4, 2021
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20210265446
Publication date
Aug 26, 2021
SAMSUNG DISPLAY CO., LTD.
Byeong Beom KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20210225813
Publication date
Jul 22, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210091021
Publication date
Mar 25, 2021
Kabushiki Kaisha Toshiba
Hiroaki TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
Publication number
20210005560
Publication date
Jan 7, 2021
TEXAS INSTRUMENTS INCORPORATED
Richard Allen Faust
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
Publication number
20200402950
Publication date
Dec 24, 2020
IMEC vzw
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
Publication number
20200286844
Publication date
Sep 10, 2020
TEXAS INSTRUMENTS INCORPORATED
Keith Edward Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20200075556
Publication date
Mar 5, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20190304948
Publication date
Oct 3, 2019
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...
Publication number
20190221533
Publication date
Jul 18, 2019
INFINEON TECHNOLOGIES AG
Horst THEUSS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20190123026
Publication date
Apr 25, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
Publication number
20180366427
Publication date
Dec 20, 2018
INFINEON TECHNOLOGIES AG
Michael Rogalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
Publication number
20180366428
Publication date
Dec 20, 2018
INFINEON TECHNOLOGIES AG
Roman ROTH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
Publication number
20180350761
Publication date
Dec 6, 2018
INFINEON TECHNOLOGIES AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT, TRANSPOSING COMPONENT, METHOD FOR FABRICATING...
Publication number
20180240767
Publication date
Aug 23, 2018
AU OPTRONICS CORPORATION
Yi-Cheng LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20170323869
Publication date
Nov 9, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device
Publication number
20170236793
Publication date
Aug 17, 2017
LG Innotek Co., Ltd.
Yeong Deuk Jo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
Publication number
20170221842
Publication date
Aug 3, 2017
INFINEON TECHNOLOGIES AG
Roman ROTH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Metal Structure Electrically Connected to...
Publication number
20160379947
Publication date
Dec 29, 2016
INFINEON TECHNOLOGIES AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
Publication number
20160322318
Publication date
Nov 3, 2016
EV GROUP E. THALLNER GMBH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS