Thermal treatments

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CPC
H01L2224/03848

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03848Thermal treatments

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure with conductive feature and method of forming same
- Patent number 12,211,809
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 11,830,837
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,569,185
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with air gap and manufacturing method thereof
- Patent number 11,302,662
- Issue date Apr 12, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,233,023
- Issue date Jan 25, 2022
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating the electronic component, and method for tra...
- Patent number 11,069,638
- Issue date Jul 20, 2021
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,840,135
- Issue date Nov 17, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with post passivation structure
- Patent number 10,727,191
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...
- Publication number 20240413109
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Young Su YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF
- Publication number 20240203920
- Publication date Jun 20, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006359
- Publication date Jan 4, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND SEMICOND...
- Publication number 20230411320
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Tadashi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20230048311
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328437
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME
- Publication number 20220208702
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220122930
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AIR GAP
- Publication number 20220077091
- Publication date Mar 10, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF
- Publication number 20210343668
- Publication date Nov 4, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20210225813
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210091021
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
- Publication number 20200286844
- Publication date Sep 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Keith Edward Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20200075556
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure with conductive feature and method of forming same

Process flow for fabrication of cap metal over top metal with sinte...

Method for permanent connection of two metal surfaces

Stacked semiconductor structure and method

Semiconductor device and method of manufacturing semiconductor device

Method of forming brass-coated metals in flip-chip redistribution l...

Flat metal features for microelectronics applications

Semiconductor package with air gap

Semiconductor structure including buffer layer

Additive manufacturing of a frontside or backside interconnect of a...

Stacked semiconductor structure and method

Semiconductor device and method of forming the same

Display device

Method of manufacturing semiconductor device

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device, electronic component and method

Semiconductor device including bonding pads and method of manufactu...

Method for the electrical bonding of semiconductor components

Power semiconductor device load terminal

Method of designing a layout, method of making a semiconductor stru...

Semiconductor package with air gap and manufacturing method thereof

Method for permanent connection of two metal surfaces

Semiconductor device and method of manufacturing semiconductor device

Method for fabricating the electronic component, and method for tra...

Stacked semiconductor structure and method

Contact structures with porous networks for solder connections, and...

Flat metal features for microelectronics applications

Metal bonding pads for packaging applications

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Semiconductor device with post passivation structure

Patents Applicationslast 30 patents

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

COMPENSATION METHOD FOR WAFER BONDING

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

ALLOY FOR METAL UNDERCUT REDUCTION

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND SEMICOND...

Stacked Semiconductor Structure and Method

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH AIR GAP

SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE

Stacked Semiconductor Structure and Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

Stacked Semiconductor Structure and Method

METAL BONDING PADS FOR PACKAGING APPLICATIONS