Thermo-compression bonding

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CPC
H01L2224/86203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/86203Thermo-compression bonding

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Patents Grantslast 30 patents

Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 11,069,664
- Issue date Jul 20, 2021
- LUMENS CO., LTD.
- Daewon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,643,942
- Issue date May 5, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,468,342
- Issue date Nov 5, 2019
- Compass Technology Company, Ltd.
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and a method for fabricating an electronic device
- Patent number 9,018,742
- Issue date Apr 28, 2015
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 8,263,438
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 7,880,277
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
BONDING AND INDEXING APPARATUS
- Publication number 20190206829
- Publication date Jul 4, 2019
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130187259
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
- Publication number 20120157804
- Publication date Jun 21, 2012
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting a die assembly to a substrate in an integrate...
- Publication number 20070040251
- Publication date Feb 22, 2007
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS

Thermo-compression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding and indexing apparatus

Micro-LED module and method for fabricating the same

High-speed, high-resolution electrophysiology in-vivo using conform...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Apparatus for the material-bonded connection of connection partners...

Formation of fine pitch traces using ultra-thin PAA modified fully...

High density interconnection of microelectronic devices

High density interconnection of microelectronic devices

Electronic device and a method for fabricating an electronic device

Method for connecting a die assembly to a substrate in an integrate...

Method for connecting a die assembly to a substrate in an integrate...

Patents Applicationslast 30 patents

BONDING AND INDEXING METHOD

THERMOCOMPRESSION BONDING DEVICE

BONDING AND INDEXING APPARATUS

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY

Electronic Device and a Method for Fabricating an Electronic Device

High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...

Method for Connecting a Die Assembly to a Substrate in an Integrate...

Method for connecting a die assembly to a substrate in an integrate...